On December 2, Qualcomm released the new computer/notebook computing platforms Snapdragon 8cx Gen 3 and Snapdragon 7c+Gen 3, as well as the Snapdragon G3x platform that can be used for game consoles, AR/VR glasses, and set-top boxes. Qualcomm has officially updated their Chinese names, which are respectively "the third generation of Snapdragon 8cx", "the third generation of Snapdragon 7c+" and "the first generation of Snapdragon G3x". However, for the convenience of writing, Snapdragon 8cx Gen 3, Snapdragon 7c+Gen 3 and Snapdragon G3x Gen 1 are used in the following paragraphs.

Snapdragon 8cx Gen 3 uses Samsung's 5nm LPE process. Qualcomm claims that its CPU multitasking performance has been improved by 85%. According to the information seen by notebookcheck on the field test machine, the CPU is composed of four 2.995GHz class X1 super cores+four 2.4GHz class A78 cores, L2 cache is 6MB, and L3 cache is 8MB. When idle, the frequency of Snapdragon 8cx Gen 3 can be reduced to 0.72GHz.

According to the official PPT, the power consumption of Snapdragon 8cx Gen 3 is slightly more than 15W, which is 25% lower than the power consumption of the 22W X86 processor (the model is not announced naturally), and 25% higher in performance. As a reference, the 2.84GHz X1 super core of Snapdragon 888 has a single baking CPU peak power between 2.1W and 3.1W, and the peak power of 840MHz Adreno 660 GPU is 9W.

From the perspective of specifications, the performance improvement of Snapdragon 8cx Gen 3 should be very obvious. Even considering the performance degradation of Windows 11 on the ARM platform, it should be enough for daily use.

The on-site test machine seen by notebookcheck ↑

In terms of GPU, Qualcomm has played down the digital naming of Adreno CPU this year, so it has no reference and only claims that the GPU will increase by 60%. It claims that the AI engine can provide 29 TOPS of computing power, and its performance is three times that of the previous generation. The memory supports up to 8x16 channels of LPDDR4x 4266MHz and UFS 3.1/NVMe solid state.

Snapdragon 8cx Gen 3 supports up to 4K screens, and can be connected to up to 2 4K screens through DP-MST (daisy chain). It supports 4K HDR 120fps video hard solution, VP9, but not AV1 hard solution. It supports up to a single 24 megapixel camera and four way camera.

It is also a FastConnect 6900, supporting Wi Fi 6E and 2x2 MIMO, Bluetooth 5.1. The 5G baseband of X62, X55, and X65 (the latest Snapdragon 8) can be selected. The peak downlink speeds are 4.4Gbps, 7.5Gbps, and 10Gbps respectively. In addition, Qualcomm claims that its notebook products can have a life span of more than 25 hours.

Notebookcheck saw the Onsite Snapdragon 7c Gen 3 test machine ↑

For the Snapdragon 7c+Gen 3, 6nm process, the official did not provide detailed specification data, claiming that the CPU single core performance was improved by 30%, the multi-core performance was improved by 60%, and the GPU was improved by 70%. It claims that its CPU performance is 30% higher than that of its entry-level competitor (the model is unknown). It has 6.5 TOPS AI computing power, X53 5G baseband, 3.7Gbps download peak, FastConnect 6700, and supports Wi Fi 6E. Strangely, the model of the test machine seen by notebookcheck on site is 7c Gen 3, 2.4GHz, 1.5MB L2 cache, and 2MB L3 cache.

Snapdragon 8cx Gen 3 and Snapdragon 7c+Gen 3 chips are expected to be launched in the first half of 2022.

Snapdragon G3x Gen1 can be used in game consoles, AR/VR glasses, set-top boxes and other devices, with only very rough information and completely unknown performance specifications. Some netizens on the post bar found that the picture of G3x chip contact is exactly the same as that of Snapdragon 888, but I don't know whether it is a mistake or a coincidence. In addition, Qualcomm and Thundersnake jointly launched a development kit (similar to a model machine) in a handheld form, with a 6.65-inch 120HzOLED and a 6000mAh battery.

Snapdragon 8 Gen1, Snapdragon 8cx Gen3, Snapdragon G3x Gen3, Snapdragon 7c+Gen3, Qualcomm's naming system has indeed been comparable to USB-IF (do you remember USB 3.2 Gen 2x2?)

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