On November 8, it was reported that Qualcomm officially announced that this year's Snapdragon Technology Summit will be held from November 30 to December 2. If not unexpected, the new generation flagship SoC, the rumored Snapdragon 898 (SM8450), will be officially released at that time.

According to the information that has been circulated, the Snapdragon 898 platform will use Samsung's 4nm process technology, the CPU is a 1+3+4 three cluster architecture, integrating one 3.0GHz X2 super core, two 2.5GHz large cores and four 1.79GHz small cores. The GPU is Adreno 730, and the baseband may be integrated with the latest X65; GeekBench scored at the single core 1200/multi-core 3900 level.

After a whole year of "Fire Dragon" 888, the power consumption and heating of the new generation SoC may be the most important concern of the aircraft industry, but the latest news is not optimistic.

On November 7, Lenovo's product manager, "Lin Lin - A Little White Rabbit", sent a microblog message, "The new fire stove... mobile phones are also increasingly testing the performance of the platform to dissipate heat", which was deemed to imply that the energy consumption performance of Snapdragon 898 has not improved much. In August this year, the blogger "Digital Chat Station" also teased SM8450 samples "as hot as ever, but fortunately, it is also available in winter".

Judging from the release rhythm of Snapdragon 898, the first models will probably be launched from the end of the year to the Spring Festival next year, similar to last year. According to the latest news, in addition to Xiaomi 12, which may be released before the end of the year, Lenovo will also join the first launch of Snapdragon 898. Its Motorola brand has announced that it will launch a flagship new machine called moto edge X, which is rumored to be equipped with Snapdragon 898 chip.

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