On the afternoon of June 14, at the Qualcomm Voice and Music Developers Conference held in Shenzhen, Qualcomm announced the launch of a new smart audio platform to help manufacturers accelerate the development and commercialization of smart and networked speakers. This flexible solution provides two Qualcomm system on chip (SoC) options based on APQ8009 and APQ8017, as well as a series of software configurations, designed to support OEMs to create truly optimized smart speakers across different product levels and categories. The integrated platform has a unique combination of processing power, connectivity options, voice user interface and top audio technology to help meet the growing demand of consumers for intelligent speakers with comprehensive features and high visibility.
This integrated high-quality voice solution aims to provide advanced multi microphone far-field voice functions through highly responsive voice activation and beamforming technology. The platform's voice software also includes echo cancellation, noise suppression and "interrupt" functions, which support reliable voice interfaces in noisy or noisy environments, even when users are far away from smart speakers.
In addition, Qualcomm announced the addition of new major products to its existing broad audio system on chip (SoC) platform product portfolio. Each platform can be customized separately to support new market demands, and the first scheme provides significantly improved processing performance; The second one can support programmable flexibility at the price of fixed function ROMs; The third solution can support the development of wired USB-C audio equipment with excellent sound quality. These platforms are also designed for specific applications and use cases, including next-generation high-performance headphones and speakers, midrange headphones and speakers with comprehensive performance, and wired USB-C headphones.
CSRA68100 is the company's next generation high-performance single chip Bluetooth audio programmable platform designed for top wireless speakers and headsets. Compared with its predecessor products, CSRA68100 can provide four times the DSP processing capacity and a powerful 32-bit dedicated developer application processor. This platform provides OEMs with more abundant programming resources and enables them to develop applications with unique differentiation characteristics. The highly integrated platform also supports a comprehensive selection of connectivity, system processing, audio processing, and power management resources. The platform includes the next generation audio development kit (ADK) ADK6.0, which can provide developers with a set of applications and configuration files certified by the Bluetooth SIG, as well as a multi processor software development environment, tool chain and audio DSP framework. The new toolkit will simplify and enhance the development experience, accelerate the design of use cases that can run multiple functions simultaneously, and create a rich end-user experience through simple switching between functions.
QCC3XXX is a new entry-level programmable audio SoC platform series, which can support Bluetooth headsets and speakers at a competitive price. These devices will be able to support a series of rich features, use cases and customized functions, help OEMs develop unique products for market segments, and are no longer limited to the functions of ROM chip solidification. QCC3XXX series includes eight SoCs, three of which support Bluetooth speaker applications and five of which support Bluetooth headset applications. Together with Qualcomm's development kit, these devices are designed to provide a flexible platform to help design high-quality Bluetooth audio products. QCC3XXX series aims to support consumers to enjoy advanced technology in listening equipment at the most economical price.
On the same day, Qualcomm launched the next generation of DDFA audio amplifier technology that supports high-resolution audio devices, including wireless speakers, soundbars, networked audio and headphone amplifiers.
Although traditional Class D amplifiers have high efficiency, they usually cannot provide the sound quality supported by traditional linear amplifiers. DDFA's full digital pulse width modulation (PWM) and proprietary closed-loop architecture make up for the nonlinearity of the power supply stage and output stage. While retaining the advantages of Class D amplifier, it provides higher fidelity audio and higher design flexibility.
The next generation of DDFA will be integrated into CSRA6620 system on chip (SoC). CSRA6620 is a highly integrated platform, including DDFA controller, microcontroller and configurable audio processor supporting eight channel input and two channel output. Compared with the previous ones, the above features help OEMs integrate the best amplifier performance in the industry with lower complexity and more economical way. The new CSRA6620 platform adopts a 9mm * 9mm square QFN package, which makes it perfect for smaller products and brings high audio performance to many new categories and applications.
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