Yesterday, Qualcomm Snapdragon demonstrated its flagship processor of this year, Snapdragon 835, for the first time in Asia. Naturally, it should now be called Qualcomm Snapdragon Mobile Platform. The 835 itself has different characteristics from previous products: more than 3 billion transistors are integrated, and Samsung 10nm FinFET technology is used for the first time. Compared with the previous generation Snapdragon 820, the overall package size is reduced by 35%, and the smaller chip size means that OEMs have more space for other parts when manufacturing equipment.

Compared with the upgrade of other parts of the SoC, the most significant improvement of the Snapdragon 835 this time is that the CPU has been upgraded to eight cores, the baseband with 1Gbps downlink speed has been added, and the process has been upgraded to 10nm.

The following is the performance reference of Snapdragon's third-generation mobile platform.