On the evening of February 24, it was reported that Mark Liu, co CEO of TSMC, disclosed at the annual supply chain management forum that TSMC would pilot produce 5nm process as planned in the second half of 2019. Their 7nm process will be trial produced in the first quarter of 2017 and mass produced in 2018, and then 5nm.

The above figure is the previous process schedule

In fact, TSMC has just started mass production of the 10nm process. TSMC's 10nm process is mainly aimed at mobile equipment, and will be shipped in batches in the first quarter of 2017, and expand the capacity in the second half of 2017. Those who can use TSMC's 10nm process will include MediaTek's Helio X30, Huawei's Kirin 970 and Apple's A11 processors.

In addition, TSMC claims to be the first manufacturer to confirm that it will use EUV. It will hand introduce EUV extreme ultraviolet lithography technology on the 7nm process and comprehensively apply it on the 5nm process.

Depending on the rise of mobile devices, TSMC is in the ascendant in recent years, but it is estimated that Intel will be confused by such an intensive and optimistic schedule

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