Tomorrow (20th) ASUS new product launch, the day after tomorrow (21st) LeEco new product launch, and next week (27th) Xiaomi new product launch. Coincidentally, the protagonists of the three press conferences are rumored to be Snapdragon 821 processors. Maybe it was stimulated by the Apple A10 of iPhone 7/7 Plus, and Snapdragon 821 needed three rounds to fight back. Let's summarize the highlights of the three press conferences in advance.

Asustek is likely to release its ZenFone 3 Deluxe again in mainland China, otherwise the task of launching Snapdragon 821 in mainland China will fall on LeEco's super phone. It can be predicted that according to the voting activity issued by the official micro blog of ASUS smart phone, plus the three network access licenses previously exposed, ASUS ZenFone 3, ASUS ZenFone 3 Ultra and ASUS ZenFone 3 Deluxe should all appear at the press conference tomorrow. The suspense is just whether ASUS ZenFone 3 Deluxe will be able to travel across the sea.

Interestingly, unlike ordinary new product release posters, the new product promotion posters of ASUS Smartphone Official WeChat for a week in a row introduce the manufacturing process of many traditional Chinese handicrafts. According to the data of three new products of Asus ZenFone 3 series previously released in Taiwan, their process design is still relatively suitable for today's consumers. There are 2.5D curved Corning gorilla reinforced glass, metal elements, fingerprint identification module, family style wiredrawing concentric circle texture, and the first stealth antenna eliminates the white belt on the fuselage. On the other hand, ASUS TriTech three hybrid focusing system is introduced, which can adjust LDAF, PDAF or continuous focusing mode according to the use situation, and cooperate with the exclusive PixelMaster 3.0 camera technology. Support Qualcomm Quick Charge 3.0 fast charging technology, with virtual channel surround sound effect.

It is worth mentioning that the Asus ZenFone 3 series released in Taiwan has abandoned the former Intel platform and fully embraced Qualcomm processors. Asus ZenFone 3 uses Snapdragon 625, Asus ZenFone 3 Ultra uses Snapdragon 652, Asus ZenFone 3 Deluxe uses Snapdragon 820, and Asus ZenFone 3 Deluxe Prestige uses Snapdragon 821.

Then came the third generation LeTV super mobile phone. Not long ago Jia Yueting's microblog tail has been replaced with LePro 3. In addition, Lin's updated microblog has also revealed a picture of the real machine, further proving that there will be at least one LePro 3 in the new product released the day after tomorrow. From the close-up of the back of the real machine, we can see that the Le Pro 3 combines the Le Max 2 convex camera and the red rice Pro brushed metal body. Of course, based on the information previously exposed by Anthare and other channels, Snapdragon 821 is likely to appear in the new product launch conference. Several groups of new product warm-up posters seen from the super phone and Jia Yueting's official WeChat account are all jokes about the iPhone 7/7 Plus released recently, including the words that we don't need to change the color matching, cancel the 3.5mm headphone interface, and lead more than 140 days. It can be seen that the CDLA standard will be extended to LePro 3.

The last, of course, is Xiaomi, who issued the new product poster this morning. From the "S" on the poster, we can infer that the new product will be Xiaomi's 5S mobile phone. The word "they" can infer that there are at least two new products. As for Snapdragon 821, 6GB RAM+256GB ROM, 3D Touch and other attributes that are rumored to appear will not appear on the poster for the time being. However, there is still a week or so before the press conference for publicity. Who can say for sure?