It has been some time since the release of Samsung Galaxy S7/S7 Edge. The Russian media have already dismantled the Exynos 8890 version of the Galaxy S7d. Recently, the famous foreign dismantling website iFixit finally dismantled the Galaxy S7 in detail. This time, it is the Snapdragon 820 version. Let's take a look at the differences in the internal circuit design between the 820 version of the Galaxy S7 and the Exynos 8890 version.
Let's take a look at the detailed configuration of Galaxy S7 of Snapdragon 820:
5.1 inch Super AMOLED display, 2560 × 1440 resolution (576 PPI)
Qualcomm Snapdragon 820 processor, Adreno 530 GPU, 4 GB RAM
12 megapixel rear camera, dual pixel auto focus, 4K video capture; 5 megapixel front camera
32GB/64 GB internal storage space, supporting microSD/TF card expansion (up to 200 GB)
Waterproof performance grade of IP68
Android 6.0.1 Marshmallow
The overall appearance of the Galaxy S7 is quite similar to that of the Galaxy S6. Both have 5.1 inch screens and are very similar in terms of body size. The only obvious difference between the front of the phone is the color of the metal ring of the Home key. The Galaxy S7 is dark color matching, which looks very low-key.
The back of the fuselage is quite different. Although the overall shape is still similar, there are obvious differences between the two. First, the two sides of the S7 fuselage are equipped with hyperbolic glass similar to Note5, which is more advanced than S6 in the sense of holding. Second, the camera bulge of S7 is significantly reduced, only slightly higher than the fuselage. The camera volume control is quite good.
Close up of earpiece and sensor. The design of the earpiece is slightly different from that of S6. The position of the sensor, front camera and LED indicator light is almost the same as that of S6. In the figure, we can also clearly see the edge radian of 2.5D glass, which is more three-dimensional and round than S6.
Galaxy S7 does not use the currently popular USB Type-C interface, but the previous Micro USB interface. Although USB Type-C is the general trend, Micro USB interface is still more general at present.
The US Galaxy S7 comes with a USB adapter to ensure that no matter what cable you use, it can be used normally.
The Galaxy S7 is disassembled in the same order as S6, starting from the back. First, heat and soften the glue on the S7 back glass to facilitate our disassembly.
Use suction cups and paddles to slowly separate the rear cover. Because S7 has added IP68 waterproof, so the glue is more than S6, and the disassembly is slightly more difficult.
The back cover of the Galaxy S7 does not have a rubber seal ring, but uses glue+adhesive tape to achieve IP68 waterproof.
The adhesive strip at the same position in the rear cover of S6 is white, while the black adhesive strip is replaced in S7, which may be changed for waterproof capability.
The circuit board cannot be seen after removing the back cover. To remove the guard board on the main board, the guard board is fixed by cross screws, which can be easily removed.
Remove the top guard board, which may be the S7 antenna, and connect it to the mainboard through contacts.
NFC coil and wireless charging coil.
Speaker section. The disassembly of this part is more difficult than before, and it is difficult to replace the battery, which also affects the final maintenance score of S7.
These are the various coils and signal antennas we removed.
These modules are all connected to the main board through spring contacts, which makes replacement easier.
The battery is pasted on the middle frame with double-sided adhesive tape and can be removed with a paddle.
The battery of S6 is only 2550mAh, so the endurance is weak. Samsung has improved the battery to 3000mAh on S7, so the endurance has been greatly improved.
Next, we continue to remove the motherboard. After unplugging the flat cable, we can remove the front camera. The front camera is 5 million pixels and the aperture is f/1.7.
After the front camera is removed, the motherboard can be separated. Similar to Samsung's previous design, there is a sub board below the main board.
Next, we separate the rear camera, which is connected to the motherboard through a flat cable.
Different from the S6's 16 million pixel rear camera, the Galaxy S7's camera is 12 million pixels and uses the dual pixel auto focus technology. The focusing speed is further than S6's.
The camera uses the IMX260 sensor provided by Sony, with a unit pixel area of 1.4 microns. Compared with the 16 million pixel sensor of S6, IMX260 can reduce noise and improve the overall image quality. After the lens is separated, the sensor can be seen. Compared with S6, although the pixels are reduced, the camera improves the imaging quality in dark and ultra dark environments.
Let's take a look at the chips on the S7 motherboard. Front of mainboard:
Red: SK Hynix H9KNNNCTUMU-BRNMH 4 GB LPDDR4 SDRAM operating memory is covered with Qualcomm MSM8996 Snapdragon 820 processor
Orange: Samsung KLUBG4G1CE 32 GB UFS 2.0 flash memory chip
Yellow: Anhuagao AFEM-9040 multi band and multi-mode RF chip
Green: Murata FAJ15 front-end module
Light blue: Qorvo QM78064 high-frequency RF fusion module
Dark Blue: Qualcomm's WCD9335 Codec audio chip (Xiaomi 5 also uses this chip. We suspect that most models using Snapdragon 820 processors will use this WCD9335 Codec audio chip, which seems to be Qualcomm's packaging solution.)
Purple: Qorvo QM63001A diversity receiving module
Back side of mainboard:
Red: Murata KM5D18098 Wi Fi module
Orange: NXP NFC 67T05 controller
Yellow: IDT P9221 wireless power receiver
Green: STC LSM6DS3 6-axis IMU (3-axis accelerometer+3-axis gyroscope)
Light blue: Qualcomm PM8996 PMIC
Dark Blue: Qualcomm QFE3100 Envelope Tracker (packet tracking module)
Purple: Qualcomm WTR4905+WTR3925 RF transceiver
Audio chip analysis:
Snapdragon 820 Gal Axy S7 uses Qualcomm's own WCD9335 Codec audio chip, while Exynos 8890 uses the Lucky CS47L91 Codec audio chip, which may come from Cirrus Logic. Lucky CS47L91 is a Codec audio chip. From the model, it may be a product of cooperation between Samsung and Cirrus Logic. Compared with ordinary mobile phones, the Codec chip solution will significantly improve the sound quality. Similar cases include the 338S1285 of the iPhone 6s (produced by Cirrus Logic) and the AK4961 of Nubia Z7. However, there is still a significant gap between Codec and the combination of independent Dac+op amps, and Samsung often uses Codec chips on its Exynos flagship phones. Qualcomm version uses its own Codec chip WCD9335. According to past experience, the sound quality of Qualcomm version is likely to be inferior to Exynos version.
Now let's continue to disassemble and remove the ribbon cable to remove the waterproof headphone socket.
The headphone jack has a rubber sealing ring, which should be designed for IP68 waterproof.
There are also many rubber sealing rings near the noise reducing microphone and earpiece to improve the waterproof ability.
We tried to separate the sub board at the bottom, but found that some of the ribbon cables on the sub board extended to the back of the middle frame and were glued to the middle frame by the screen.
We first heat the screen to soften the glue, and then use a paddle to remove the OLED screen.
After the screen is separated, you can remove the key ribbon cable and the entire sub board.
Overall view of the secondary panel. It has a main microphone, USB interface and touch buttons.
Next, separate the heat pipe from the middle frame.
The heat pipe inside S7 is very thin.
Let's demonstrate the position of the motherboard corresponding to the heat pipe. The heat pipe covers several main chips, including running memory+SoC, memory chip and several chips with large heat generation. The location of the heat pipe is very reasonable.
Finally, the family photo of the Galaxy S7. We can see that the circuit design is quite compact. The main board, auxiliary board, wireless charging coil and antenna are all modular design, which is convenient for maintenance to a certain extent. However, iFixit's maintenance score for the Galaxy S7 is only 3 points (the full score is 10 points). It can be seen that after adding IP68 waterproof, The influence on the difficulty of the whole machine maintenance is relatively large.
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