Recently, the Russian science and technology blog Hi-tech.mail.ru disassembled the Samsung Galaxy S7 just released yesterday. In their disassembly, they confirmed that the Samsung Galaxy S7 uses copper tubes to dissipate heat. There is a long copper tube on the middle frame, which is used to transmit the heat generated by the chip to the middle frame to help dissipate heat. The shielding cover on the main board is connected with the heat pipe on the middle frame through thermal conductive silicone grease to increase the contact area and heat conduction efficiency.
The design of the Galaxy S7 continues the design style of Samsung, so it does not need too many professional tools to disassemble the device.
Because I have disassembled the Galaxy S6, I have a good understanding of the internal structure of S7. Like other mobile phones with glass panels, the Samsung Galaxy S7 needs to use a hot air gun to heat up the glue on the back and soften it before disassembling the rear glass panel.
After the back cover is removed, there is no rubber gasket at the interface, but a large amount of glue is used to seal it, which may be the reason why the Galaxy S7 can still maintain such a thin body after having IP68 waterproof grade.
Unlike Sony's SIM card slot design, Samsung does not provide a waterproof cover for the SIM card slot. Instead, it installs a waterproof rubber ring on the SIM card slot, which is automatically sealed when the SIM card is inserted. It should be noted that when inserting the card slot, there should be no large particles of dust on the card slot, otherwise, moisture may enter the interior of the fuselage through these gaps.
It can be seen that there is a large amount of glue inside the rear cover for sealing. Various coils are pasted on the battery for wireless charging and NFC.
Microscopic close-up of flash lamp and heart rate sensor.
After removing the middle board, we can see the battery, main board and various components. The main board chip of the single blade main board can be covered by a metal shield.
After removing the motherboard, we can see that a long and thin thermal conductive copper tube is installed on the middle frame. It is connected to the metal middle frame, which can quickly transmit the heat from chips such as processors to the middle frame to help heat dissipation. On the thermal conductive copper tube, two pieces of thermal conductive silicone grease correspond to the processor and the main heating chip on the motherboard.
The position of the red circle in the figure is "water inlet test paper". If water enters the fuselage, it will turn red. This is also one of the standards for Samsung official maintenance to judge whether the machine is flooded.
Samsung Galaxy S7 is equipped with a 3000mAh battery. The standard battery is 3.85V, and the maximum charging voltage is 4.4V. Since the battery is made in China, most of the words on the battery are in Chinese.
The left is the iPhone speaker, and the right is the Samsung Galaxy S7 speaker.
Enlarged close-up of power contact switch.
A close-up of motherboard chips. Most chips have no logo or recognizable logo. The LTE modem is Samsung Shannon 935, and the power amplifier is Angaohua Avago AFEM-9030.
The left side is the main board of Samsung Galaxy S5, and the right side is the main board chip of Samsung Galaxy S7. They are very similar in design structure. S7 continues the consistent design style of Samsung Galaxy S series.
After removing the shield, we finally saw the memory chip and Exynos 8890, which were soldered on the circuit board. The Exynos 8890 is covered under the memory chip, so we cannot directly see the Exynos 8890.
Finally, a group photo of all parts of the Galaxy S7 was taken. Samsung Galaxy S7 used a lot of glue to achieve IP68 waterproof, because it did not sacrifice the size of the body for waterproof like S5. In addition, the Galaxy S7 is also equipped with a heat pipe for the first time to dissipate heat. Through the more efficient heat pipe, the heat of the processor is channeled to the metal middle frame, increasing the heat dissipation area, so as to have better heat dissipation capability. Even if the game is played for a long time or used with high intensity, there is no need to worry about the frequency reduction of the processor due to overheating. This is the first time in Samsung's full range of mobile phones that a heat pipe cooling scheme has emerged.
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