According to foreign media reports, Samsung For the next generation flagship smartphone Galaxy S7 test Heat pipe heat dissipation At present, Samsung is testing heat pipes of different sizes and shapes provided by different suppliers, but it has not yet determined whether heat pipes will be used for heat dissipation.

"Loop cooling pipe" launched by Fujitsu

Samsung will resume the Qualcomm+Exynos dual processor version strategy on the next generation flagship model, and provide the Snapdragon 820 version in the U.S. and Chinese markets, while the international version is Exynos 8890. Previously, some media reported that the Snapdragon 820 still has a fever problem. Although it has not been confirmed, this possibility does exist. It is not surprising that Samsung took the lead in testing the heat pipe design in a proactive manner.

It is well known that Snapdragon 810 has severe heating and frequency reduction. Many mobile phones using 810 use heat pipe for heat dissipation, such as Sony Xperia Z5 Premium and OnePlus 2. Facts have proved that heat pipes can effectively reduce the temperature of mobile phones. Sony even used double heat pipes to suppress the heat of 810.

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