The popularity of true wireless Bluetooth headsets cannot be separated from the chip solutions provided by upstream manufacturers. On the evening of December 16, Qualcomm released the latest midrange Bluetooth audio chip Qualcomm QCC305x SoC series. The biggest feature of this Bluetooth headset chip scheme is that it supports all-weather voice wake-up and the upcoming Bluetooth LE Audio (Bluetooth Low Energy Audio) standard, enabling a mobile phone to connect multiple Bluetooth headsets or Bluetooth speakers and other audio receiving devices at the same time.

Qualcomm claims that QCC305x supports audio technologies including:

• Audio sharing (Bluetooth LE Audio standard), one mobile phone can share audio with multiple wireless receiving devices at the same time

• Support all-weather voice wake-up

• Qualcomm Adaptive Active Noise Reduction (ANC) reduces the fitting of earplugs and experience difference caused by different use scenarios

• Qualcomm aptX ™ Adaptive, supporting 96KHz

• Qualcomm aptX ™ Voice and Qualcomm cVc ™ Echo cancellation and noise suppression (call noise reduction)

  
  

Now the official website has introduced the QCC3056 Bluetooth chip specification: WLCSP package, size 4.38 x 4.26 x 0.4mm, 94 pins, Bluetooth 5.2, Bluetooth LE Audio standard, dual core 32-bit CPU up to 80MHz+dual core 120MHz configurable Kalimba ™ DSP (running from ROM).

Public Bluetooth Headset Solution on Qualcomm's official website (iPhone for models)

It is estimated that many Bluetooth noise reduction earphones will use this new scheme next year, but I don't know whether the price and endurance of new products will be improved next year.

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