On June 22, it was reported by Taiwan Economic Daily that Qualcomm's flagship SoC Snapdragon 875 and the next-generation 5G baseband X60 had been launched in TSMC last week.

The CPU of Snapdragon 875 is expected to be upgraded to Kryo 685 based on Cortex-A78 architecture, but the frequency is unknown, and whether the actual performance growth will still be Buddhist remains unknown. Judging from the speed of release, the next generation Snapdragon flagship is expected to be released earlier than in previous years.

Sources said that before the ban came into effect on May 15, TSMC devoted almost all its resources to the production of Hisense chips. After the ban, HiSilicon originally had a large number of 5nm orders, some of which were received by AMD and Qualcomm.

In an interview on the 21st, TSMC said that it would not comment on the nodes of individual customers and the capacity planning of various processes. The P1 and P2 plants of Nanke 18, the main base of TSMC 5nm, have been operating at full capacity, and the 5nm production capacity has increased to 60000 pieces per month (an increase of more than 10%). The industry estimates that the monthly launch volume of Qualcomm 5nm chips ranges from 6000 to 10000. In addition, it was revealed that AMD proposed to TSMC that the monthly film size exceeded 20000 films.

With the news that Apple's A14 and Qualcomm X60 baseband had been put into production last week, TSMC seemed to be very aggressive this year, and all 5nm chips were mass produced earlier than expected.