On May 23, it was reported that MediaTek, a well-known chip manufacturer, announced the launch of Helio P22, a mobile phone processor for the low-end market. The processor is manufactured by TSMC's 12nm FinFET process. The CPU part is designed with 8 cores, all of which are A53, and the maximum dominant frequency is 2.0GHz. The graphics part adopts PowerVR GE8320, with a maximum frequency of 650MHz, a maximum display resolution of 1600x720, and a maximum screen scale of 20:9.

In terms of memory support, Helio P22 supports LPDDR3/4X with a maximum frequency of 1600MHz and a maximum capacity of 6GB; In terms of built-in storage, it can support eMMC 5.1 flash memory chip.

In terms of camera functions, Helio P22 supports a 13 million pixel+8 million pixel smart dual camera solution, or a maximum of 21 million pixels for the camera. In addition to the conventional camera performance upgrade, it also adds the AI face unlocking function of the original front camera, with the help of a common deep learning computing framework. In terms of baseband, P22 supports all Netcom, and adds support for dual cards and dual 4G standby. The downlink rate is up to Cat. 7, and Bluetooth has entered the era of 5.0.

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