According to the foreign media Engadget, LG will hold two press conferences to introduce its new flagship mobile phone G7 ThinQ. The conference in New York will be held on May 2, while the conference in Seoul will be held on May 3. Due to the time difference, these two conferences may be held simultaneously.

In the press release released by LG today, the official said that the AI function of the new machine will enhance the interoperability with other devices. In the previously exposed LG G7 real machine picture, a button was added on the right side of the machine. It is reported that the LG G7 ThinQ will use the relevant design for AI.

▲ LG G7 real machine diagram

Previously, it was revealed that LG G7 ThinQ was equipped with a banging screen on the front, and LG may hide bangs on the software level. The new machine is equipped with Qualcomm Snapdragon 845 processor and 6GB RAM+64/128GB ROM. Rear dual 16 megapixel camera, V30S AI camera function will also appear on LG G7 ThinQ, and 3200mAh battery and 3.5mm headphone hole are built-in. The price of the new machine is expected to be 850 dollars/950 dollars (about 5350 yuan/6000 yuan).

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