Samsung Galaxy S9/S9+is the default player of Android in the first half of this year. Before the detailed reviews from all walks of life, the Galaxy S9+of Snapdragon 845 and Exynos 9810 had been disassembled and the ban was lifted on March 9, US time. Now let's take a look at the internal structure of Xinjihuang:
In terms of configuration, the front of the Galaxy S9+maintains a 6.2 inch AMOLED screen, 2960 * 1440570PPI. Qualcomm Snapdragon 845 or Samsung Exynos 9810, with a main camera of 12 million pixels, supports F1.5/F2.4 aperture switching, and also supports optical anti shake sub camera of 12 million pixels and 8 million pixel front camera. IP68, Android 8.0 system.
Snapdragon 845 Galaxy S9+Disassembly
Dismantle the ifixit that is familiar to all Galaxy S9+users of Snapdragon 845. The disassembly method is also to use the hot air gun to soften the adhesive of the back cover, and then open it through the suction cup and the stick. When opening the cover, pay attention to the wiring connected to the fingerprint sensor on the upper right side of the back cover.
F1.5 Aperture mode (pay attention to the main lens)
F2.4 Aperture mode (pay attention to the main lens)
This camera, which supports F1.5/F2.4 aperture switching, is the largest among the flagship cameras in 2018 and the only one that supports the mechanical aperture switching function. With the additional mechanical structure, the main camera has a significant growth, which is a whole circle larger than the telephoto sub camera with optical anti shake.
In order to ensure that the aperture shape of a normal lens can be close to a circle, the aperture must have at least five blades, while the Galaxy S9+has only two rotating annular blades. Because there is no need to switch multiple apertures, Samsung can make even two blades round.
The fingerprint sensor is stuck on the glass back cover. To our disappointment, Samsung still uses the traditional flat cable to connect the fingerprint sensor, and the adhesive is very tight, so the fingerprint sensor was almost sacrificed when it was pried out.
The two covers inside the fuselage are fixed by 16 screws, and integrated with wireless charging coil, antenna and bottom speaker. The battery is 3.85V, 3500mAh and 13.48Wh in total, which is consistent with the battery parameters on Note7 and S8+that were blown up in the same year.
The blue circuit board is the Snapdragon 845 camera, and the green circuit board is the Exynos 9810 camera. The disassembled 9810 is Samsung's new ISOCELL, SAK2L3。 After disassembly, it can be seen that there is an obvious size difference between the 1/2.55-inch main camera sensor and the 1/3.42-inch secondary camera sensor.
8 megapixel front camera
The new iris sensor is different from the S5K5E6YV used in Note 7 and Galaxy S8
After removing the motherboard, you can take out four cameras (rear dual camera, front camera and iris camera) on the Galaxy S9+. The bottom sub board has a microphone, Type-C connector and a large number of spring contacts.
The heating separation middle frame and screen, Samsung's AMOLED flexible screen, flat cable and circuit board are pasted on the back of the screen by folding, and the touch IC is Samsung's S6SY761X.
The forehead layout on the front of the fuselage is the same as that of S8, with iris scanner, front camera, infrared transmitter and distance sensor. That's all for the disassembly of the basic structure.
The following is the introduction time of the chip:
Motherboard front Yes:
Samsung's 4GB LPDDR4X memory, model K3UH6H6-NGCJ, below which is Qualcomm Snapdragon 845;
Toshiba 64GB UFS flash memory, model THGAF4G9N4LBAIR
AVAGO AFEM-9096 KM1746
Qualcomm's audio decoding chip Aqstic ™ WCD9341
The power management IC is Maxim MAX77705F
Qualcomm's QET4100 Cigna Tracker
The audio amplifier is Maxim MAX98512
The back is:
The Wi Fi and Bluetooth modules are Murata KM7N16048
NFC controller is NXP 80T17
Qualcomm PM845 Power Management IC
Modem Qualcomm SDR845 101
RF power amplifier is Skyyworks 78160-11 15575.1 1748 MX
Qualcomm PM8005 Power Management IC
Family portraits
Disassembly of Galaxy S9+Exynos 9810
The disassembly of Exynos 9810 is completed by the famous chip level disassembly mechanism techinsights.
The core part is Samsung's SoC Exynos 9810, which is covered by Samsung's 6GB LPDDR4X (model K3UH6H60AM-AGCJ) memory. The 9810 uses Samsung's 10nm LPP process (the second generation 10nm FinFET process). Compared with the first generation 10nm LPE, the 9810 can improve the performance by 10% or reduce the power consumption by 15% (the last year's Snapdragon 835 and Samsung Exynos 8895 used this process).
Because of the same structure, we started chip time directly. The front of the motherboard is:
Maxim MAX98512 audio amplifier
Avago AFEM-9090 front-end module
Skyworks SKY77365-11 power amplifier module
Murata fL05B power amplifier module
Shannon 735 envelope tracker
Samsung Exynos 9810 and 6GB LPDDR4x memory
Samsung UFS flash memory, model KLUCG2K1EA-B0C1
Maxim MAX77705F Power Management IC
Broadcom's BCM47752 GNSS receiver
Wireless charging receiver of IDT P9320S
The back of the motherboard is:
Samsung 82LBXS2 NFC chip
Maxim MAX98512 audio amplifier
Samsung S2MPB02 camera power management IC
Samsung's Shannon 560 power management IC
Cirrus Logic CS47L93 Audio Codec
Samsung S2DOS05 Display Power Management IC
Samsung Shannon 965 RF Transceiver
Follow our Weibo @ Love Computer
Follow our WeChat official account: playphone
Of course, we also pay attention to our Bilibili account: love computer
