On November 15, it was reported that the UBS Global Technology Conference was in full swing. Navin Shenoy, executive vice president and general manager of the data center department of Intel, said that Intel would launch a DIMM memory module based on 3D XPoint storage technology in 2018. 3D XPoint high-speed memory chip is jointly developed by Intel and Micron. At present, Intel has launched Aoteng Optane SSD products, including Optane SSD DC P4800X Optane SSD 900P， In addition, there is an Optane 3D XPoint cache disk for HDD acceleration.

From the constraints announced by Intel at present, the speed and durability of Optane can be improved by a thousand times compared with ordinary MLC SSDs, claiming to be the largest revolutionary breakthrough in the storage industry in 25 years. However, the current test results show that its speed and durability have not reached the theoretical value, but are more than 10 times the current memory particles.

In order to increase the output of 3D XPoint storage chips, Intel and Micron jointly built the No. 60 building of Utah IM Factory to increase production capacity. However, the promotion of 3D XPoint still has a long way to go. The JEDEC Solid State Storage Association has not yet finalized the NVDIMM-P standard and the interface has not been finalized. In addition, Intel has not yet launched CPUs and chipsets that support 3D XPoint storage chips, which are currently only used for servers and data centers.

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