Meizu recently launched a new series of Meilan works - Meilan E2. The machine has made some improvements on the basis of Meizu Taowa's face, and the overall design style has changed. However, in today's increasingly homogeneous smart phones, Meilan E2 still cannot achieve very high recognition, but the positive change has at least given a positive signal to the vast number of Meizu friends.

On the whole, Meilan E2 retains an integrated all metal body, which is still round in appearance, but slightly more square than the previous design.

In addition, Meilan E2 uses a newly designed alternating flash lamp, which will have different flash combinations when different reminders are given. Let's take a look at the workmanship of the new Meilan E2.

PS： The internal structure of Meilan E2 is complex, and the disassembly requires professional tools. Ordinary users should not try it easily.

The overall fuselage of Meilan E2 adopts a typical screen+washer+middle frame, which is fixed on the metal back cover with a snap. Main board parts, circuit boards and screens are installed on the middle frame, and can be further disassembled by separating the snap.

First, unscrew the Torx screws on both sides of the USB interface at the bottom, and separate the SIM card slot to prevent damage to the phone during separation.

Use a paddle to slowly separate the clips along the lower edge of the washer at the edge of the screen. After all the clips are separated along the screen, open the back cover. The circuit part is a typical three-stage design. The main board is located at the top, the middle is the battery, and the bottom is the secondary board. Because of the deep design of the buckle and the high strength of the frame material, the author struggled for a long time in removing the rear cover. Although it is not easy to remove, I should praise the strength of this shell.

There are multiple contacts on the inner side of the rear cover that are connected with the main board and the auxiliary board. In addition, the injection molded partition strip on the rear cover acts as an antenna.

The motherboard is covered by a large number of metal shielding covers. First, we will remove the baffle covering the battery cable.

In order to prevent short circuit and other problems during disassembly, first separate the battery cable, and then further disassemble it.

The auxiliary plate cover plate is fixed with cross screws, and the cover plate can be opened after all the screws are unscrewed.

Separate the flat cable and coaxial cable between the mainboard and the secondary board.

After all the cables on the sub board are separated, the sub board can be removed. Note that the vibration motor is fixed on the middle frame with glue, so be careful not to damage the connecting cable when separating.

Paste the flat cable of the Home button on the middle frame and carefully separate it.

The Home button uses a patch switch. There are rubber rings around the button to help keep the Home button stable.

The structure of the secondary board is relatively simple. In addition to the vibration motor, there are 3.5mm headphone jack, USB interface, etc.

The overall structure is simple and clean, and the solder joints are full and firm.

Then, separate the main board. The main board is fixed with multiple cross screws. After removing the screws and confirming that all cables are separated, remove the main board.

After the mainboard is separated, it can be seen that there are many contacts on the middle frame connected to the mainboard, and the screen panel and the middle frame are bonded together, so the screen flat cable is also fixed on the middle frame.

The battery is also bonded to the middle frame, with a capacity of 3400mAh.

The front and rear cameras are connected to the motherboard through the flat cable and adhesive tape, and can be removed by pulling the flat cable and tearing the adhesive tape.

Front camera.

Now let's take a look at the motherboard. The design of the motherboard is quite neat. The front and back are covered by a large number of metal shielding covers. The part with large heat output is covered with copper foil to help improve heat dissipation. The design of heat dissipation is still in place.

After the copper foil is torn off, a thermal conductive silicon pad is attached to the chip below, which can conduct more heat to the copper foil, and then from the copper foil to the metal frame, further increasing the heat dissipation area.

Most of the chips are covered by the shield. We use a hot air gun to separate the metal shield on the motherboard one by one.

Now let's take a look at the main chips on the back of the motherboard, which are occupied by the main memory, SoC and memory chips.

MediaTek MT6757V belongs to Helio P20 chip, but actually the memory chip is packaged with SoC, the memory chip is located at the top, and the SoC is located at the bottom.

The SEC 704 next to it is an eMMC memory chip from Samsung, with a capacity of 64GB.

Now let's take a look at the chip on the front of the motherboard.

We answer from right to left. The MT6351DV on the right is the power management IC from MediaTek.

The MT6625LN below is a multi-function transmission module from MediaTek, including WiFi dual band, Bluetooth 4.0, GPS and other functions.

The MT6311DP above is the power management IC of MediaTek.

The TFA9890A with the same bright side on the left is the speaker driver IC.

The MT6176V on the lower side is from MediaTek, which is also the power management IC.

The AIROHA AP6712M on the left is a RF chip from Loda Technology.

The BQ25892 on the top is a fast charging control chip from Texas Instruments.

The last one is the family photo. The left side is the metal back cover, the right side is the screen and the middle frame, and the middle from top to next is the front and rear camera, flat cable, main board, secondary board, home button, and secondary board cover. On the whole, although the configuration of Meilan E2 has not yet broken through, it has maintained Meizu's consistent standard in the overall workmanship and the design and workmanship of the internal circuit. The circuit design is neat and clean, the materials are solid, and the solder joints are full and firm. When we remove the shield with a hot air gun, the firm solder joints still cause us great difficulties, This is another way to reflect the work of Meilan E2.

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