Recently, vivo launched a new generation of flagship model Xplay6 after the Xplay5, which continues the design style of Xplay5, adopts a hyperboloid screen that is more amazing than Xplay5, and retains an integrated metal body, which is more rounded in appearance and quite amazing at the first glance. The HiFi system is further improved on the basis of the Xplay5 flagship version. It uses the ES9038Q2M independent DAC. The independent op amp is also upgraded from OPA1612 to OPA1622, which is also three. As the first model equipped with ES9038Q2M, the Xplay6 is undoubtedly one of the most powerful competitors of the best HiFi mobile phones in active service. Let's take a look at the design and workmanship of the Xplay6.

PS: The internal structure of vivo Xplay6 is complex, and professional tools are required for disassembly. Ordinary users should not try it easily.

Of course, pull out the SIM slot before disassembly to prevent accidental damage to the machine body during disassembly.

The design of the Xplay6 has been passed down from generation to generation, retaining the design of the double Torx screw at the bottom.

The design of hyperboloid screen+integrated metal body continues as a whole, and the screen is still disassembled. It is preferred to first remove the Torx screw next to the USB interface at the bottom.

The hyperboloid glass is first pasted with the white washer, and then fixed with the metal back cover through the buckle.

The hyperboloid screen used by Xplay6 is quite close to Samsung, and the overall screen is quite smooth. The difficulty of the screen is greater than that of the Xplay5. Be careful to use force to prevent the screen from cracking during disassembly. We use paddles to slowly separate along the gap between the screen and the body.

After disassembling the back cover, you can see the internal structure of the main board, battery, etc. The main board is covered by a metal screen cover, which is full of materials.

The back cover is a full metal one-piece molded back cover commonly used by Vivo. There is a large area of graphite heat dissipation sticker inside the back cover, which is very careful in heat dissipation. However, the Xplay6 has no injection molded NFC antenna, which may still have no NFC function.

The edge of the combination of the back cover and the middle frame is covered with a ring of adhesive tape, which can not only make the body more closely combined, but also effectively prevent the ash from entering.

The inner edge of the metal back cover has multiple antenna contacts. The thickness of the graphite heat sink is very conscientious.

Anyone familiar with Vivo knows that Vivo likes to use metal shielding covers on various flat wires and chips, and the Xplay6 goes further, using exaggerated overall shielding covers, and the whole motherboard is almost covered by metal shielding covers. Vivo adopts the design of chip covering independent metal shield cover+copper foil+overall shield cover+graphite heat dissipation sticker+rear cover, and the heat dissipation design is very careful.

In terms of the internal circuit design, we continue the common design of motherboard+battery+sub version. However, after we disassembled it, we found another mystery. The circuit structure design of this phone is more complex than any previous mobile phone.

The camera module is located in the center of the main board shield, and two cameras are installed on a separate metal module, while the flash is installed on the main board.

The top of the motherboard has a plurality of metal contacts that contact the metal back cover for the signal antenna.

The SIM card slot is also covered by a large area of metal shield, and the workmanship is quite solid.

The bottom is a secondary plate, which is fixed with plastic baffle. At the bottom, from left to right, are speakers, Micro USB connectors, call microphones, and 3.5mm headphone connectors.

After removing the plastic baffle, you can see the secondary board. The loudspeaker is located on the baffle and connected to the secondary board through contacts.

The circuit of the secondary board is relatively simple, with fewer chips. There are two flat cable interfaces on the front. Because there is also a flat cable at the bottom, we cannot remove the secondary board for the time being. We can remove the secondary board after the battery is removed.

First remove the metal shield of the whole motherboard, and the battery cable is covered under the shield.

Unscrew the screws to remove the metal shield, which is easier than the Xplay5. We can see that most of the main chips on the motherboard are still covered by independent metal shielding covers welded to the motherboard, and some shielding covers are pasted with copper foil to help heat dissipation.

There are several flat cable connectors on the front of the motherboard. We will remove them one by one. The edge of the middle frame is pasted with a buffer sponge, which can make the direct combination of different parts more firm.

First, disconnect the battery cable to ensure that there is no circuit damage due to short circuit during disassembly.

The battery is a lithium polymer battery with a capacity of 4000mAh and a nominal voltage of 3.85V.

The battery is stuck on the middle frame with double-sided adhesive tape, but vivo has designed a handle for easy disassembly. First pull the label 1, then pull the label 2, and the battery can be easily removed. After removing the battery, you can see a large area of flat cable hidden below.

Then remove all the flat wires and coaxial cables on the sub board. Note that there are also two wide flat wires on the back. Do not use brute force when removing.

Then the sub plate can be removed. The two small flat cables on the front of the sub board are used to connect the Home button and the touch button, and the large flat cables on the back are used to connect the main board and the sub board.

There is a large metal shield on the back of the motherboard, with copper foil on the surface.

The front is simple in structure, with a small shielding cover, which is also covered with copper foil.

Some chips on the front of the secondary board. The picture above shows TI BQ24192, which is a battery charger IC.

After separating various flat cables and coaxial cables, including screen flat cables, you can remove the motherboard. In addition to a large number of screws, the edges are also fixed with a ring of black adhesive.

Remove the main board, the metal shield on the back of the main board is covered with a large area of copper foil, and is connected to the middle frame through thermal conductive silicone grease. This design can better transmit heat to the middle frame to help heat dissipation. Vivo has spared no effort in the use of the metal shield. There is no exposed chip on the back of the motherboard.

The front of the main board of the Xplay6 also has two large area copper heat sinks, which are made of the same materials.

After removing the mainboard, we can remove the camera. The rear camera of Xplay 6 is 12 million+5 million pixels, and the Sony IMX362 sensor uses 12 million pixels. It is equipped with 4-axis OIS optical anti shake, and the lens aperture is f/1.7 (the official parameter is f/1.75, which seems to be a temporary work place...). The two cameras are glued to the metal frame, which is quite firm. They are connected to the motherboard through the flat cable.

The front camera is 16 million, equipped with a soft light self timer similar to X7/X9, and the soft light is fixed on the motherboard.

After we tear the copper foil on the back of the motherboard, we can see that the SoC+flash memory chip uses a large amount of thermal conductive silicone grease. Vivo is very unambiguous in heat dissipation. The metal shield can reduce the mutual interference between chips, which is helpful to the signal of the mobile phone and the sound quality of the HiFi system.

Then we use a hot air gun to remove all the shielding covers on the front and back of the motherboard, and you can see all the chips on the motherboard.

There are fewer chips with larger front area of the motherboard, mainly various small capacitors.

There are a large number of chips on the back of the motherboard, which we will interpret one by one.

Samsung's K3RG6G6 0MMMMGCJ's LPDDR4 memory chip is located on the back of the motherboard, with a capacity of 6GB. It is packaged with Qualcomm MSM8996, or Snapdragon 820, which is manufactured using the 14nm FinFET process. It is equipped with Adreno 530 graphics processor, which is consistent with the chips used in the Xplay5 flagship except for the label 。

The other chip with large area next to the memory chip is Qualcomm PM8996 power management IC.

The other chip with a larger area is located on the front of the motherboard. It is Samsung's KLUDG8J1CB-B0B1 flash memory chip. It is a UFS2.0 flash memory chip with the same capacity of 128GB as the Xplay5 flagship version, and uses MLC G3 1Lane particles.

Then the focus of this disassembly - audio chip.

In terms of audio chips, as the Vivo official said, the chip of the first ESS in Vivo has become the norm, and Xplay6 is no exception. It uses the world's first ES9038Q2M. From the chip area, it is smaller than the ES9028Q2M used in the Xplay5. In addition, there is a dual clock crystal oscillator beside the DAC chip. ES9038Q2M is the first release of ES9038 mobile version, which is exclusive to vivo for the time being. The relevant parameters are not clear yet.

Like the previous generation, Xplay6 also uses a two-stage three op amp, but it has been upgraded to OPA1622 (used in Feiao X7, Hammer M1, M1L and other products). This is an amplifier from Texas Instruments Burr Brown Audio series. It is an upgrade of OPA1612 (used in the top configuration of Xplay5), which is widely used. The Xplay6 audio circuit is special. The three op amp chips are arranged on the secondary board and connected to the main board through the flat cable, Intuitively seems to affect the sound quality?

Qualcomm WTR3925 LTE transceiver.

Skyworks 77824-11 LTE power amplifier module.

NXP's TFA9890A, an audio chip, is mainly used for Smart PA audio solutions, with class-D amplifiers. Smart PA can greatly increase the output power of external amplifier and improve the sound quality level.

Qualcomm QCA6174A wifi and Bluetooth integration module.

Qualcomm PMI8996 power management IC.

Qualcomm WCD9335 audio decoding chip (Codec) is a packaged audio solution of Qualcomm Snapdragon 820/821.

RFMD RF7460 multi-mode and multi frequency PA module.

Other chips:

Summary:

Finally, the old practice, The whole family photo of Xplay6 has been disassembled. So far, we have finished the disassembly of the new generation flagship Xplay6. In general, as the current flagship of Vivo, Xplay6 continues Vivo's exquisite workmanship and solid circuit materials. The layout of the motherboard is very neat and tidy. Almost all chips of the motherboard and sub board are equipped with metal shielding covers, and the materials are very luxurious.

In the processor/memory/power management chip part, the thermal conductive silicone grease+copper foil+metal shielding cover+thermal conductive silicone grease+metal middle frame is used to assist heat dissipation. However, the firmware may be too early, so the temperature control is not ideal in actual performance.

Of course, the biggest highlight of the device is still the HiFi module, which is further upgraded on the basis of the Xplay5 flagship version. The first ES9038Q2M independent DAC is launched, and the op amp chip is upgraded to three OPA1622 independent op amps, The DAC chip is also equipped with a dual clock crystal oscillator, and the audio stacking is still quite violent. The beautiful appearance, exquisite workmanship, excellent performance, powerful photography, and violent audio modules all together form this amazing Xplay6, which will undoubtedly be one of the most powerful competitors of this year's best HiFi mobile phone.

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