recently Vivo launched the Captain of the United States Xplay5 flagship mobile phone. The Xplay5 is the first domestic hyperboloid mobile phone with a hyperboloid screen+integrated metal body design. The flagship version uses Vivo's new HiFi 3.0 system, two ES9028Q2M independent DACs, and three OPA1612 independent operational amplifiers. There is no doubt that the Xplay5 flagship version will be the best audio quality in the mobile phones in service, Let's see where the secret of Vivo's super sound quality is.
PS: The internal structure of the flagship Xplay5, Captain Vivo of the United States, is complex. The disassembly requires professional tools, and it is difficult to restore after disassembly. Ordinary users should not try it easily.
Unplug the SIM slot before starting disassembly. The design of the Xplay5 flagship has been passed down in one continuous line. First remove the Torx screw next to the USB interface at the bottom. The Xplay5 flagship version adopts the design of hyperboloid glass+all metal integrated body, so we start to disassemble the screen and use a paddle to slowly separate along the gap between the screen and the body.
The hyperboloid glass is first pasted with the white washer, and then fixed with the metal rear cover through the buckle. Care should be taken during disassembly to prevent the buckle from breaking.
After disassembling the back cover, you can see the internal structure of the motherboard, battery, etc. The back cover is a vivo all metal integrated rear cover. There is no injection molded NFC antenna inside the back cover. The Xplay5 flagship may also have no NFC function.
The fingerprint identification module is integrated on the back cover and connected to the main board through contacts. This design also facilitates the disassembly of the back cover.
The internal circuit design is a relatively standard design of motherboard+battery+sub version.
Disconnect the battery cable of the phone first. All cables of vivo are fixed by metal baffle+screws, which can prevent cables from loosening due to shaking.
Vivo uses metal baffles on all cables for fixation, which is quite stable.
To facilitate the separation of the main board, first remove the loudspeaker sub board, and then further disassemble it.
The loudspeaker, USB interface and vibration motor are in the sub board.
After removing all baffles and screws one by one, separate various flat wires and coaxial cables, including screen flat wires,
The battery is stuck on the middle frame with double-sided adhesive tape, but vivo has designed a handle for easy disassembly. First pull the label 1, then pull the label 2, and the battery can be easily removed.
The battery uses the same lithium-ion polymer battery as the standard version, with a capacity of 3600mAh.
Next, you can remove the motherboard. In addition to a large number of screws, a ring of black glue is used to fix the edge of the motherboard.
Remove the main board, cover the metal shield on the back of the main board with copper foil, and connect it with the middle frame through thermal conductive silicone grease. This design will better transmit heat to the middle frame to help heat dissipation. Compared with the standard version, the Xplay5 flagship version also adds a large area of copper heat sink on the middle frame. The material used is quite conscientious, and we have spared no effort to improve heat dissipation.
The motherboard is covered with a metal shield, basically without exposed chips.
The back of the motherboard is also covered with a metal shield. The copper foil on the shield can enhance the heat dissipation of each chip.
After removing the mainboard, we can remove the camera. The rear camera of the Xplay 5 is 16 million pixels. With Sony IMX298 sensor and lens aperture of f2.0, there is no optical anti shake. The front end is 8 million, so the two are relatively close in volume.
After we tear the copper foil on the back of the motherboard, we can see the large area of metal shielding cover below. The SoC+flash memory chip still uses thermal conductive silicone grease and thermal copper foil. The metal shield can reduce the mutual interference between chips, which is helpful to the signal of the mobile phone and the sound quality of the HiFi system.
The shielding covers on the front of the Xplay5 flagship motherboard are all soldered on the motherboard. We use a hot air gun to heat them and slowly remove them.
There are also a large number of shielding covers on the reverse side. If you remove all the shielding covers, you can see the specific models of all chips.
The most prominent Samsung K3RG6G60MM-MGCJ LPDDR4 memory chip on the back of the motherboard, with a capacity of 6GB, is packaged with Qualcomm MSM8996, or Snapdragon 820, which is manufactured using 14nm FinFET technology and equipped with Adreno 530 graphics processor.
The other one with larger volume is the KLUDG8J1CB-B0B1 flash memory chip from Samsung. The chip area is 11.5 × 13 × 1.2mm, which meets the UFS2.0 specification, with a capacity of 128GB, and uses MLC G3 1Lane particles.
Then finally came the audio chip, which used two ES9028Q2M independent DACs and matched up to three OPA1612 independent op amps.
The other chip with large area on the reverse side is Qualcomm PM8996 power management IC 。
Qualcomm WTR3925 LTE transceiver.
Skyworks 77824-11 LTE power amplifier module "Power Amplifier Module For FDD LTE".
Skyworks 77629-51 Multimode Mutiband Power Amplifier - Multifrequency and multi-mode power amplifier.
NXP TFA9890A high efficiency class-D audio amplifier with a sophisticated speaker boost and protection algorithm.
TI BQ24192 I2C Controlled 4.5A Single Cell USB/Adaptor Charger w/ Narrow VDC Power Path。
Take a look at the chip on the front of the motherboard. Skyworks 85709-11 5GHz 802.11ac wlan front end module - 5GHz 802.11ac Wi Fi module.
Qualcomm QCA6174A wifi and Bluetooth integration module.
Qualcomm PMI8996 power management IC.
Qualcomm WCD9335 audio decoder chip.
Finally, we present a family photo of the entire family, which is the flagship version of the Xplay5, Captain Vivo of the United States. So far, we have finished the disassembly of the flagship version of the American captain vivo Xplay5. In general, the Xplay5 flagship version continues the excellent internal circuit design of vivo, the motherboard layout is quite neat, and shielding covers are installed on most chips. The processor/memory/power management chip that generates the most heat uses thermal conductive silicon pad+copper foil+thermal conductive silicone grease+heat dissipation copper foil+metal middle frame to enhance heat dissipation. The material used is quite conscientious.
In addition, for the first time in the world, the device uses two ES9028Q2M independent DACs on the mobile phone, and is equipped with up to three OPA1612 independent op amps. The stacking is quite extravagant, which is unique in the current mobile audio field. It is no exaggeration to call it the strongest audio phone on the market at present.
