Vivo recently released a new flagship Xplay5 series of mobile phones, The Xplay5 adopts the design of hyperbolic screen+integrated metal body, which is quite amazing in appearance, and adopts vivo's new HiFi 3.0 system. Considering the excellent performance of vivo in audio in the past, we have no doubt that we have high expectations for the sound quality of the Xplay5. Now please follow our steps to see where the secret of the super sound quality of vivo is.
PS: The structure of vivo Xplay5 is complex, and many parts are difficult to restore after disassembly. Ordinary users should not try it easily.
Remember to unplug the SIM slot before starting disassembly.
The Xplay5 has the consistent design style of vivo. There are two Torx screws at the USB interface at the bottom. Let's start from here.
Because the Xplay5 adopts the design of hyperboloid glass+all metal integrated body, because we can intelligently remove it from the screen.
Use a suction cup to suck up the screen. The hyperboloid glass is first stuck with the white washer, and then fixed with the metal back cover through the buckle. Be careful during disassembly to prevent the buckle from breaking.
After disassembling the screen and back cover, you can see the internal structure. The back cover is the metal integrated back cover that Vivo always uses. There is no injection molded NFC antenna inside the back cover. The Xplay5 is likely to castrate the NFC function.
In terms of circuit design, it is a relatively prepared design of motherboard+battery+sub version.
The press fingerprint identification is installed on the back cover and connected to the main board through contacts, which relatively simplifies the difficulty of removing the back cover.
The battery is stuck on the middle frame with double-sided adhesive tape. It needs to be removed by heating+paddles.
Disconnect the battery cable of the phone first. All cables of vivo are fixed by metal baffle+screws to prevent cables from loosening due to shaking.
The battery is a lithium ion polymer battery with a capacity of 3600mAh.
All cables, including cameras, are fixed with metal baffles, and we remove them one by one.
In order to facilitate the separation of the main board, we removed the speaker sub board and the metal baffle, and then separated various flat cables and coaxial cables, including the screen flat cable, before further disassembly.
The loudspeaker, USB interface and vibration motor are in the sub board.
Next, you can take down the motherboard. The motherboard is covered with a metal shield, and there is basically no exposed chip.
The back of the motherboard is also covered with a metal shield, and a whole piece of copper foil is covered on the shield to enhance the heat dissipation of each chip.
After removing the mainboard, we can remove the camera. The rear camera of the Xplay 5 is 16 million pixels. With Sony IMX298 sensor and lens aperture of f2.0, there is no optical anti shake. The front end is 8 million, so the two are relatively close in volume.
After we tear the copper foil on the back of the motherboard, we can see a large area of metal shielding cover below. The position where heat conduction is applied is the SoC+flash memory chip. So many metal shielding covers should be designed for HiFi system to reduce mutual interference between chips.
The shielding covers of the Xplay5 are all soldered on the main board. We use a hot air gun to heat them and remove them one by one.
The specific models of various chips can be seen after removing most shielding covers.
The most prominent Samsung's 0BMFGCF-K30F4F4 LPDDR3L memory chip on the back of the motherboard, with a capacity of 4GB, is packaged with Qualcomm Snapdragon 652, four Cortex-A72 and four Cortex-A53, which are made with 28nm HPM process and paired with Adreno 510 graphics processor.
The other large piece is the THGBMHG9C8LBAIG flash memory chip from Toshiba, which uses a 15nm process, meets the eMMC 5.1 specification, and has a capacity of 128GB.
Then finally came the audio chip, the CS4398CN DAC chip from Cirrus Logic. CS4398CN is the top decoding chip of Cirrus Logic. This exquisite disk supports 24 bit/192kHz decoding, with a signal noise ratio of 120dB and a distortion rate of - 107dB. It is a very classic DAC chip. Vivo has great experience in tuning this chip.
51AP8LI ADC3001 audio conversion chip from Texas Instruments next to CS4398CN.
Next to the DAC chip, we also found a chip model of "539Y5P", which is the new AD45257 operational amplifier chip promoted by vivo.
PM8004 power management chip from Qualcomm.
Qualcomm PM8956 PMIC chip (power management integrated circuit).
Qualcomm PMI8952 PMIC chip (power management integrated circuit).
Qualcomm WTR2965 RF chip.
Skyworks 77824-11 RF power amplifier. （FDD LTE）
Skyworks 77629-21 RF power amplifier. （ GSM EDGE WCDMA HSDPA）
Finally, I present a disassembled family photo of vivo Xplay5.
From the perspective of this disassembly, Xplay5 continues the excellent work of vivo. The motherboard design is very neat, almost all chips are covered by shielding covers, and thermal conductive silicone grease+copper foil is used to assist heat dissipation in the processor+memory chips with high heat generation, and special metal baffles are used to fix the cables, so the materials can be said to be more conscientious. The whole machine adopts the design of curved screen+integrated metal back cover, and the structure is quite compact and rigorous. As the first domestic mobile phone with a hyperboloid screen and an all metal integrated body, the vivo Xplay5 not only has a beautiful appearance, but also has a quite reliable internal design, which can be described as a combination of internal and external skills.
