The fourth generation Moto X will also be equipped with heat pipes?
The fourth generation Moto X will also be equipped with heat pipes?
2016-12-22 11:54

Online outflow The fourth generation Moto X 's spy photo, this rumor uses Snapdragon 820 The common heat dissipation copper tube of notebook computer appears in the box of. It was also rumored that Samsung also used Snapdragon 820 Galaxy S7 It will use copper tubes for heat dissipation, which indicates that the Snapdragon 820 may also be a very "feverish" SoC.


In spy photos, the middle frame of the machine doubles as the chip shielding cover (gold part), and the bottom is a double speaker opening (the classic design of upper and lower speakers has been canceled?). The body has become more square and similar iPhone 5s The three-stage metal of Moto X (the classic multi material rear cover of Moto X may also disappear?). In addition, it is impossible to put down the fingerprint identification module at the logo, and it is rumored that similar products will be used One plus two The square type home key of is used to complete fingerprint identification.


However, we are more concerned about the fever of Snapdragon 820. After all, Samsung LG、 Sony and a number of domestic manufacturers will carry Snapdragon 820 in their flagship next year. If it goes the way of Snapdragon 810, the flagship next year will also step into the hole.

It is almost certain that the fever level of Snapdragon 820 will still be much higher than that of Snapdragon 801/800 and other SoCs in that year. Although the copper tube can solve the problem of local heating to some extent, the SoC of power consumption will still have a significant impact on the battery life of the mobile phone. If you want to reduce the frequency and ensure the battery life every day, then the strong extreme performance will be meaningless, which is really a sad story

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