vivo X6Plus It was officially launched on December 14, and one of the highlights of this product is the use of the world's first ES9028 Q2M+ ES9603 Q combined audio chip. After we got this mobile phone, we disassembled it for the first time. Let's have a look at its powerful inner "core":
PS: The disassembly process of the vivo X6Plus is almost irreversible in many places. It is recommended that ordinary users do not try. They don't talk much about it. There are pictures and facts:
The first step and iPhone It's a bit similar. We start with the two screws at the bottom, and use a quincunx screwdriver.
Of course, don't forget to take out the card slot.
Use the suction cup to suck up the screen, and the metal back cover is fixed with the front panel through the snap, so it needs to be handled carefully.
After the rear cover is separated, it can be seen that the rear cover is indeed a full metal design with a high degree of integration. The antenna part is treated by injection molding.
In particular, the rear cover Push fingerprint recognition It is directly connected by metal contacts, and there is no flat cable, which facilitates the removal of the rear cover to a certain extent (however, the buckle of the rear cover is very tight, and the removal is very difficult).
For safety reasons, before further disassembly, of course, disconnect the power supply. The flat cables of the X6Plus are fixed with metal buckles and screws, so that the flat cables are not easy to loosen. It is indeed excellent in terms of reliability, but it will also increase the weight of the phone itself.
Take out the battery through the adhesive tape on the battery. The battery is pasted with double-sided adhesive tape. Pay attention to the force when pulling it up.
The battery is a lithium polymer battery with a capacity of 3000mAh.
Next, separate the flat cable between the screen and the small board at the bottom. The flat cable is still fixed with metal buckles and screws, which is full of materials.
Then pry off the coaxial line and the flat cable of the key.
The metal protective cover of the detached camera is also fixed with screws (fragile stickers on the screws, damage means waiver of warranty). It can be seen that the X6Plus has made careful treatment in terms of its anti fall performance.
A similar design is used at the card slot.
Next, you can take it out. It can be seen that the motherboard is covered with shielding cover and graphite heat sink.
The back of the motherboard is also covered with a shield, and you can also see a piece of copper foil, below which are SoC and flash memory chips, which are used to transmit heat to these two large heat users.
The rear camera of X6Plus is 13 million pixels with phase focus, and the front camera is 8 million pixels, so they are relatively close in size.
Tear off the graphite heat dissipation sticker, and you can see the nearly insane shield design. This is probably for the service of the HiFi system, so that it can be subject to as little interference as possible.
Tear off the copper foil of the SoC, you can see that there is pink silicone grease on the SoC, which is used for heat conduction.
Next, remove the speaker board. There are speakers and vibration motors.
The X6Plus shield is soldered to the motherboard, so we need to use a hot air gun to heat them before we can remove them (Vivo is really determined not to open this phone...).
After removing the shield, the whole motherboard looks much fresher. This side has the audio chip we are most interested in.
There are two "big block" chips, SoC and flash memory chip, on the back. The following is the introduction of the main chip:
X6Plus's "brain", MTK's MT6752 , eight core Cortex-A53 1.7GHz, a 64 bit SoC, manufactured by 28nm HPM process, matched with Mali-T760MP2 The graphics processor for. In addition, 4G memory chips are also packaged under SoC.
Samsung's KMRC10014M-B809 flash memory chip has a capacity of 64G.
MTK's RF chip MT6169V.
NXP speaker driver IC - TFA9890A.
The chip we want to see most in this disassembly is ESS's ES9028Q2M , the first chip of ES9028 series, and X6Plus, the first chip in the world, provides 129dB signal-to-noise ratio, - 120dB distortion rate, and SABRE9018AQ2M Yes, it is stronger than ES9018K2M and ES9018C2M used by other HiFi phones. From the perspective of packaging, it is the same QFN packaging as SABRE9018AQ2M.
Attachment: SABRE9018AQ2M Disassembly drawing, using QFN Encapsulation, Geek Out V2+infinity from LH Labs.
Also from ESS ES9603Q The operational amplifier chip is also the first in the world, and its performance and parameters have not been announced yet.
Yamaha digital surround sound signal processing chip YSS205X ， The "Ksong chip" of X6Plus is not available on X6.
MTK's MT6625LN multi-function chip integrates Bluetooth, WiFi, GPS, FM and other functions.
Finally, we present a family photo of the X6Plus.
From the view of this disassembly, the workmanship of the vivo X6Plus is excellent. The mainboard is neat and tidy. There are many shielding covers and graphite heat dissipation stickers on the mainboard. I believe this has something to do with the HiFi system design of the mobile phone itself. The rear cover is made of integrated metal, with high integrity. In addition, it is worth mentioning that there is reinforcement at the flat cable, which can further improve the fall resistance. In terms of the chips used, the biggest feature of X6Plus is that it uses the world's first ES9028Q2M and ES9603Q audio chip combination, together with the YSS205X digital surround sound signal processing chip like X5, which has its own hardware advantages in terms of internal amplifier and karaoke.
