Since Qualcomm released the Snapdragon 810 last year, the debate about the overheating of 810 has never stopped. The debate began before 810 was released. On the one hand, major scientific and technological media questioned the heating problem of 810, and on the other hand, Qualcomm kept denying that 810 was overheated. But the so-called paper can't stop fire. With the release of Qualcomm 810 phones by major mobile phone manufacturers, Snapdragon's fever problem has been brought to the table. Whether it is the first LG Flex2 with 810, or later HTC One M9 and Sony Z3+, it is not so "calm".
The problem of heat dissipation of mobile phones has a long history. As early as the end of 2011, Xiaomi Generation 1, equipped with Qualcomm S3 (MSM8260) 1.5GHz dual core processor, came into the public's view with Xiaomi, which is now known as the graphite heat dissipation sticker. As the first mobile phone with graphite heat dissipating sticker as its promotional selling point, Xiaomi Generation 1 does have a slightly higher heat, but this is just the beginning of the mobile phone temperature control war.
The Snapdragon 810 is not the first time in the history of mobile phones to experience overheating problems. As early as 2012, the HTC One X had overheating problems. As the world's first four core smart phone, the HTC One X uses Nvidia Terga 3 processor, which is made of 45nm process, and four core 1.5GHz. Terga series processors are famous for their heat generation. However, such high-frequency processors use the backward 45nm process (at the same time, Samsung Exynos4412 used the 32nm process). Its irritability can be imagined. The highest temperature of One X can even reach 47 ℃.
Now let's take a look at today's protagonist Snapdragon 810. As the current main force of Qualcomm's SoC, it is adopted by many Android manufacturers. It has an eight core design, a 20nm process, a 64 bit architecture, and an ARMv8-A instruction set. It is composed of four CortexA57 and four CortexA53, The A57 core frequency is 1.96GHz, while the A53 core frequency is 1.56GHz, and the GPU is Adreno430. As for how exaggerated its fever is, as shown in the figure above... Today we will check the models that use the Snapdragon 810 to count arrows.
what? Do you think as the first Flex 2 equipped with Snapdragon 810, it can escape the fate of overheating? The design is so poor. The reason why Flex 2 is not as famous as M9 and Z3+is that its unique curved screen design has a low sales volume
In the heat test, HTC M9 is like a bright light.
After the hot hand performance of HTC One like frying eggs and the camera shutdown problem of Sony Z3+due to overheating, Qualcomm finally admitted that 810 was overheated and has been working hard to fix the problem. In the released models, HTC M9 and Sony Z3+are undoubtedly the "champion of heat generation". The former shows the "fried egg" heat generation ability in heavy use due to the high thermal conductivity of the metal body. Both the local and the overall temperature are "far ahead" of other brands of mobile phones, which is also called "HTC's ultimate goal is to become Iron Man".
Sony Z3+also dare not lag behind, overheating and frequency reduction is just a piece of cake for Z3+, and the prompt that "the phone is overheated, and the camera needs to be temporarily closed" in the camera shooting test is the killer weapon of Z3+as a champion of heating. Fortunately, Z3+has a three prevention design, which can be "water-cooled". If it is overheated, pour some water to cool it
When Qualcomm 810 has such a serious heating problem, many manufacturers have begun to focus on solving the 810's heating problem, actively reducing frequency, stacking multiple cooling technologies, and even some so-called "black technologies".
Among them, LG is the most radical. As the world's first first-line mobile phone manufacturer equipped with 810, LG is very simple and straightforward in "solving" the problem of overheating. It directly gave up using 810 on its flagship G4, and instead used the 808, which has relatively stable heat and power consumption. Although Qualcomm's most high-end 810 is not used, the LG G4 has not lagged behind other flagship Android models in the media evaluation. Because the 808 has good heat control, there is no serious frequency reduction, and it is better than 810 in some run test.
In addition to LG abandoning the 810, what makes Qualcomm feel worse is another important partner - Samsung has directly abandoned Qualcomm's adoption of its own Orion Exynos 7420. Moreover, the Exynos 7420 with 14nm process is far ahead of the Snapdragon 810 in terms of performance and heat control.
After talking about these world-renowned international manufacturers, let's see how domestic manufacturers solve the problem of 810 overheating. Whether the top version of Xiaomi Note, LeTV 1 pro, LeMax, or the first and second generations all use "uniform fever" as their selling point. It's hard for Qualcomm to laugh and cry when they hit each other once. Among them, Xiaomi, OnePlus and LeEco have all adopted 810 v2.1, the third version. Qualcomm has no clear explanation, but compared with the first version of LG Flex 2 and the second version of HTC M9, v2.1 has slightly improved its fever, but it still cannot get rid of the overheated hat.
Xiaomi said that he "coordinated with Qualcomm to send several engineers to solve the heating problem", but after our disassembly, we found that Xiaomi's so-called "solution" was actually to apply thermal conductive silicone grease on the SoC, let the SoC module contact the metal middle frame of the fuselage, and use the metal middle frame as a fin to increase the heat dissipation area. This cooling mode is similar to the cooling module of notebook computer. In our game test, the maximum temperature of the top version of Xiaomi Note reached about 40 ℃ in just 20 minutes, and the heat control was not as ideal as Xiaomi advertised.
Compared with the first plus two generation, the first plus two generation is more clear, combining soft and hard. First, the 810 uses a heat dissipation module design that combines thermal conductive silicone grease, copper alloy shield and three-layer graphite heat dissipation patch; Secondly, Yijia also adopted the "H-Cube" software algorithm patent, that is, actively limiting the core frequency and stopping the core. After our test, one plus two limits the maximum frequency of the four A57 cores of 810 to 1.7 GHz, which is 300 MHz lower than the design frequency of Qualcomm. Although various active frequency reduction and core shutdown can reduce the heat of the mobile phone, this practice will obviously sacrifice the performance of the mobile phone. Although Yijia has taken various measures to limit the heat of 810, the actual effect is not ideal. In our heat test, the maximum temperature of Yijia 2 has reached an impressive 49.3 ℃, which is worthy of this list.
LeEco, deeply involved in the war of words with Xiaomi, spared no effort to promote its "dragon training technology" at the press conference. The Lying Gun model is the top version of Xiaomi Note and HTC One M9. However, no matter how LeTV boasts of its own heat dissipation technology, Le1Pro is also doomed to overheat. Its metal body has a high thermal conductivity. With the 810 furnace, the maximum temperature once reached 44.2 ℃... It can only be said that there is a long way to tame the dragon. As for what kind of heat dissipation technology is used in Le 1Pro? Sorry, please go out and turn left to ask LeEco PR.
Of course, Qualcomm has more than 810 models that will get hot. Its little brother, Snapdragon 615, will also get hot. Our emotion machine - nut mobile phone is one of them. In our heating test, the highest temperature of the nut phone once reached 47.3 ℃. Although the heating part was concentrated on the upper part of the back, 47.3 ℃ was a bit unreasonable. However, after all, the emotion machine buys feelings, and users who will buy nuts will certainly not care about these.
However, you should not think that heating is a patent of Qualcomm. The model of a brand using MediaTek Helio X10 SoC (MT6795) can also reach an amazing 51.8 ℃ after two hours of high-intensity game testing. It can be seen that in addition to the heat control of the chip itself, the manufacturer's heat dissipation design is equally important.
The above is the most "hot" potato at present. Ah no, it's mobile phones. I wonder if you have a certain understanding of mobile phones with high fever. Fortunately, now that it is winter, the problem of overheated mobile phones will not have much impact. To be fair, the problems caused by these mobile phones are not the problems of manufacturers to a large extent. From Sony's heat pipe technology, Yijia's multi-layer heat dissipation and superposition heat dissipation, we can see that manufacturers have made great efforts to solve the problem of heat dissipation. Sony even uses dual heat pipes for heat dissipation in the latest Z5. But it is futile for chip manufacturers not to fundamentally solve the problem of SoC overheating. Taking Qualcomm as an example, the high-end market has been attacked by Samsung 7420, and the mid market has been gradually eroded by MediaTek. If you are not careful, you will lose everything in this rapidly changing market. Qualcomm really needs to work harder. Eh, in this cold winter, it seems that it is not a bad thing to have a mobile phone comparable to a hand warming treasure. If you want to warm your hands, just play a game!
*Some pictures are from the network
