Since the concept of modular mobile phone was born, we have heard of many modular mobile phone brands, such as the famous Google Project Ara plan. Google has shown the prototype of Project Ara at the Google I/O conference in May, but Google still has a long way to go before it is actually released. In addition to Google, there is another company Fairphone, which is also very fast. They opened the reservation of Fairphone 2 last month. The iFixit has brought us the dismantling of Fairphone 2 before everyone gets the goods. Let's see if this phone is modular enough~
Fairphone 2 uses Snapdragon 801 SoC, 2GB memory, 32GB ROM and supports memory card expansion. It uses a 5-inch 1080LCD screen with a capacitance of 2420mAh and supports dual cards and dual cards. Of course, for this mobile phone, the configuration is all floating clouds, and modularization is the top priority.
The three dimensions of this mobile phone are 143 × 73 × 11mm, and its weight is 168g. Although 11mm in today's smart phones is not really thin, as the only modular mobile phone on the market, the concept is more than everything. In addition to its modular design, this mobile phone also has excellent fall resistance. The official claims that it can withstand a fall of 2 meters without being damaged. Fairphone also said that in the future, it will launch a three proof modular back cover.
This mobile phone is printed with a "Designed to open" on the side, highlighting its modular concept. This mobile phone is composed of 7 main parts, including the rear cover, removable battery, display module, body frame, receiver module, rear camera module and speaker module. The design is very simple.
We start from the back cover. This phone uses a translucent back cover, through which we can observe the internal circuit structure. The rear cover can be easily removed without any tools.
Have you ever seen a detachable battery? Of course, there is no difficulty in dismantling.
This mobile phone uses a 3.8V 2420mAh battery with a small capacity.
Now we continue to disassemble it. We haven't seen any screws yet. To separate the middle frame from the display panel, we just need to turn off the lock switch at the bottom.
Next, we will remove the display panel by sliding. So far we haven't used any tools.
We can see that the display panel and the main board are connected by a large area of spring shock. The orange part is the connection board between the screen flat cable and the spring contact module.
Now let's take a look at the modules in the middle frame of the motherboard:
Red: headphone jack, earpiece and front camera module.
Orange: Rear camera module.
Yellow: Microphone module.
After being disassembled here, we finally need a screwdriver! We need to remove all the screws in the blue circle. The screws are standard cross screws.
After removing the screws, we will remove all three modules.
We will disassemble the three modules one by one, first the receiver module. The screws on the module are Torx T5 screws, which need a special screwdriver to remove.
The internal structure can be seen after the module is disassembled. Similar to the design of ordinary mobile phones, the front camera is connected to the circuit board through a flat cable; The earpiece is connected with the circuit board through contacts; The headphone jack is directly welded to the circuit board.
Next, we will disassemble the rear camera module, which has only one screw. The rear camera has an inch 1/3.2 inch sensor and an aperture of f/2.2.
Finally, the microphone module. In this module, besides the microphone, there are vibration motors and speakers. USB interface and speaker are soldered on the circuit board.
Finally, let's disassemble the main board of this mobile phone.
Use tweezers to remove the metal shielding cover on the main board, and there is a large area of graphite heat sink under it.
Next, we will remove the RF cable hidden in the lower left corner and fix it with two screws.
Finally, the motherboard can be removed. We can see that there are many contacts on the slightly transparent plastic middle frame. The middle frame has a built-in antenna and all buttons, which are connected to the motherboard through the contacts. The part in the red box is a 5-pin spring contact, which is a USB2.0 interface and may be reserved for future expansion.
Now let's take a look at the chip on the front of the motherboard:
Red: Samsung KLMBG4WEBC 32 GB eMMC NAND flash memory
Orange: Qualcomm WCN3680B Wi Fi 802.11ac and Bluetooth combination module
Yellow: STC LSM330DLC 6-axis accelerometer+gyroscope
More chips on the back:
Red: Samsung K3QF2F20EM 2 GB LPDDR4 RAM. Below the memory chip is Qualcomm's Snapdragon 801MSM8974AB SoC
Orange: Qualcomm WTR1625L RF receiver
Yellow: RF Micro Device RF7389EU multi-mode multi band power amplifier
Green: Qualcomm QFE1100 envelope tracking power management
Light blue: Qualcomm PM8841 PMIC
Dark blue: Qualcomm WCD9320 audio encoder
Finally, a family photo. IFixit gave Fairphone 2 a repair score of 10 (10 is the easiest to repair). We have not seen such a high repair score for a long time. In addition to the full fit screen, each module can be disassembled and replaced separately, which is very easy to repair. It is also easy to assemble by yourself. The modular mobile phone deserves its reputation.
