Since we have higher and higher requirements for mobile phones, although the performance of the device is more and more powerful, it also brings more heat. It seems that users are not very comfortable when using mobile phones. After all, no one wants to hold a "hot potato" in their hands. Therefore, in order to solve these problems, the manufacturer has also put a lot of effort into introducing various cooling methods to solve the problem of "fever".

Graphite heat dissipation

Graphite heat sink for mobile phones

Since the launch of the first generation of Xiaomi mobile phones, as a model of high configuration and low price, in order to solve the problem of heat dissipation, Xiaomi has brought the concept of heat dissipation technology to consumers for the first time. Xiaomi launched the technology of "graphite heat dissipation" that year. As a selling point of mobile phone promotion, it also opened the precedent of mobile phone heat dissipation technology, Later, many manufacturers added various cooling technologies to their mobile phones as selling points.

Heat dissipating silicone grease

Heat dissipating silicone grease on mobile phone

Heat dissipating silicone grease

Heat dissipation silicon pad

Heat dissipating silicone grease may appear on mobile phones and feel very high-end. In fact, this product is the one you use to heat the CPU in your computer! The thermal silicon pad is also a thermal equipment that can be seen on the computer. The thermal silicon pad is often used on the video memory chip of some video cards to cool. The heat dissipation silicone pad and the heat dissipation silicone grease are matched together, so many mobile phones now use the heat dissipation silicone grease and the heat dissipation silicone pad to cool the phone.

In addition to applying heat dissipation silicone grease/heat dissipation silicone pad between the chip and the metal shield, OPPO has also introduced a "ice nest cooling" technology. In addition to the original direct covering of heat dissipation materials on the chip, "liquid like metal heat sink" has been added between the two, making the chip and graphite heat sink more closely fit, without air layer and tiny gaps, so that the chip has more area combined with heat dissipation materials, improving heat dissipation efficiency.

Heat pipe heat dissipation

360 Legendary "Space Water Cooling" Heat Dissipation Technology

Heat pipe heat dissipation principle: the heat pipe is not actually a copper pipe. It contains a large number of capillary like "liquid wicks", which can make the heat dissipating liquid in the heat pipe change according to the temperature, so that the working liquid can move to a lower temperature area after absorbing the heat and expand the heat dissipation area, so as to realize heat dissipation for computers and mobile phones.

Heat pipe radiator on computer

When it comes to heat pipe heat dissipation, we must mention the legendary "space water cooling" heat dissipation technology of 360 Qiku mobile phone. Does it sound very high? Are you shocked? In fact, it is the technology transplanted from the computer. After the CPU radiator is coated with heat dissipation silicone grease, cover the radiator. The "copper pipe" on the CPU and graphics card radiator is the heat pipe.

In fact, the use of heat pipe heat dissipation technology on mobile phones is not a new technology. In fact, Sony Sony Xperia Z2 uses a heat pipe as a heat dissipation way, and the Sony Xperia Z5 Premium released a while ago also uses two heat pipes for auxiliary heat dissipation.

Copper foil heat dissipation

Thermal design of one plus mobile phone 2

Copper foil heat dissipation is also a commonly used heat dissipation method for mobile phones on the market. Many practical Snapdragon 810 mobile phones use a combination of heat dissipation silicone grease/heat dissipation silicone pad+copper foil heat dissipation. Copper foil is often bonded on the frame/back cover of the machine to make it more closely connected with the metal shield, while in the metal shield, more heat dissipation silicone grease or heat dissipation silicon pad are used as the heat dissipation method of SoC.

No matter how advanced the heat dissipation method is or how many heat dissipation methods are combined with each other, it is not as good as SoC manufacturers' ability to use better chip architecture and heat control when designing chips. Controlling heat from the source is a better "heat dissipation" method. I hope this day will come earlier!

*Some pictures are from the network

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