The Xplay3S is the most configured mobile phone today. In addition to the title of the first 2K screen, it also has top configurations such as MSM8974AB and 3G Ram. At the same time, the Xplay3S also adheres to the HiFi mobile phone idea of vivo and adds two powerful audio chips, ES9018 and OPA2604. What about the "inner world" of this top mobile phone? Let's take a look at the manual disassembly we brought.

From the appearance, the Xplay3S doesn't have any screws. It doesn't look so easy to disassemble ▼

After the card slot is pushed out, we can pry the rear shell by using the slot position. The rear shell is fixed with plastic clips. As long as we handle it carefully, the disassembly process will not damage the fuselage ▼

After removing the back cover, unscrew the two screws ▼ of the camera cover and fingerprint identification part

There are seven screws at the bottom of the fuselage to fix the speaker below. It can be seen from this that although the sound outlet on the surface is large, the volume of the speaker is not big ▼

Remove the bottom speaker ▼ smoothly

Then deal with the top, pry open the fingerprint identification module, you can see that there is a screw hidden below, unscrew it ▼

Here is a screw with a fragile sticker. Remember to unscrew it. Of course, unscrewing it is equivalent to giving up the warranty ▼

Remove the upper speaker ▼ smoothly

As you can see, the main board of the Xplay3S is not big ▼

Carefully pull out the signal and relevant flat cable ▼

Synaptics touch chip S3508A ▼

Take out the motherboard smoothly. Since the shield on the motherboard is welded to the motherboard, we won't do destructive disassembly. Let's take a look at the chip we are most interested in ▼

Most of the main chips are concentrated on the back of the motherboard ▼

Samsung's memory chip K3QF7FF70DM has a capacity of 3GB. Only Samsung has a chip with a capacity of 3GB on the market. Because of the POP packaging, the legendary Qualcomm MSM8974AB chip is invisible (under the memory chip) ▼

Toshiba flash memory chip, model THGBMAG8AJBA4R, capacity 32GB ▼

13 million pixel rear back facing camera ▼

Front 5 megapixel camera ▼

The Xplay3S DAC, ES9018K2M, has a certain size reduction compared with the original version of ES9018, but it is absolutely luxury compared with the mobile phone. This chip was also used on vivo X3 ▼

Operational amplifier chip OPA2604, we also used to Having seen this chip before, friends with strong practical ability can try to change this chip to match their favorite sound style ▼

Qualcomm LTE chip WTR2100 ▼

Since the battery part is stuck on the middle frame, in order not to damage the battery, we will skip the disassembly part of the battery. The whole disassembly process ends ▼

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