The iPhone 6s Plus released by Apple this year has become the largest and heaviest iPhone in history. Last week, the iPhone 6s were disassembled. Today, we also disassembled the iPhone 6s Plus to see what is different from the iPhone 6s. (Source: ifixit, translation: 91 disassembly)

Before disassembly, let's take a look at the highlights of the iPhone 6s Plus:

• Apple A9 processor and M9 assistant processor

• 16. 64 or 128 GB ROM

• 5.5 inch 1920x1080 pixel (401 PPI) retinal screen, 3D Touch

• Front 500W HD camera, rear 1200W iSight camera, support 4K video recording, support optical anti shake

• 7000 series aluminum alloy housing, Lon-X glass

• Support 802.11a/b/g/n/ac wireless applications, Bluetooth 4.2, NFC, 23 LTE bands

• Tactic Engine Feedback Motor

The rear panel of iPhone 6s Plus has a big "S" character. The shell is made of 7000 series aluminum alloy. According to the analysis of professional organizations, the composition of this material is 91.17% aluminum, 0.08% iron, 7.64% zinc and 0.106% tungsten.

Take an X-ray perspective before disassembly.

As with the iPhone 6s, first use a screwdriver to remove the two fixing screws at the bottom.

Use the suction cup tool to separate the front and rear panels of the iPhone 6s Plus.

Unscrew the screws and remove the metal shielding cover fixing the battery cable.

Pry the battery cable with a crowbar.

Use a crowbar to pry out the three flat wires connecting the front and rear panels.

The front panel of the iPhone 6s Plus weighs 80g, an increase of 33% compared with the previous generation's 60g. It can be seen that Apple would rather increase its weight for 3D Touch.

Compared with the iPhone 6s, the Taptic Engine feedback motor of the iPhone 6s Plus is much smaller.

Remove the adhesive from the bottom of the battery.

Remove the battery.

The battery capacity is 2750mAh, 165mAh less than that of the previous generation.

We can take down the camera by pulling out the cable.

Compare the 6s camera. The left side is a 6s camera, and the right side is a Plus camera. The shapes of the two are basically the same, and the cable position is also the same, but the Plus camera is obviously larger.

Let's take a closer look at the Plus, a 1200W camera with optical anti shake. From the holes around the lens, we can see the added optical anti shake components of Plus.

Prepare to remove the motherboard. It is a little different from the iPhone 6s. There is a coaxial cable on the back of the Plus motherboard. Please remove it carefully.

Unplug the coaxial cable.

Now you can take down the motherboard.

Chip on the front of the motherboard:

• Red: Apple A9 APL1022 SoC and SK Hynix LPDDR4 RAM H9HKNNNBTUMUMR-NLH

• Orange: Qualcomm MDM9635M LTE Cat. 6 chip

• Yellow: Chaoqun TQF6405 power amplifier

• Green: Scarlett SKY77812 power amplifier

• Light blue: Anhuagao AFEM-8030 power amplifier

• Dark Blue: Qualcomm QFE1000 envelope tracking IC

• Purple: Ying Meisheng 6-axis gyroscope and acceleration sensor integrated chip

Chip on the back of the motherboard:

• Red: Hynix H230DG8UD1ACS 16 GB NAND flash memory

• Orange: General Science&Industry 339S00043 Wi Fi module

• Yellow: NXP NFC 66V10

• Green: Apple/Dialog 338S00122 power management IC

• Light blue: Apple/Circus Logic 338S00105 Audio IC

• Dark Blue: Qualcomm PMD9635 Power Management IC

• Purple: Scarlett SKY77357 power amplifier

• Red: Murata 240 front-end module

• Orange: RF Microdevice Company RF5150 antenna switch

• Yellow: NXP 1610A3

• Green: Apple/Circus Logic 338S1285 Audio IC

• Light blue: TI TPS65730A0P power management IC

• Dark Blue: Qualcomm WTR3925 wireless transceiver chip

• Pink: Scarlett SKY13701 cellular and GPS receiving filter module

• Black: TI 57A5KXI

Remove the speaker and flex cable.

The speakers of the Plus are very similar to those of the iPhone 6s, except for some simple changes in appearance.

Remove the small board and ribbon cable. The small board is integrated with Lightning interface components.

Similar to the iPhone 6s, the Plus also has a microphone at the bottom.

This highly integrated design saves space, but the side effect is that any part of it will be worse than the whole board.

Finally, we will have a family photo, and our disassembly will be completed here. IFixit gave the iPhone 6s Plus 7 points for maintenance (10 points is the easiest to repair). Except for the complicated pairing between the Touch ID and the motherboard, other parts are easier to repair.

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