With the rapid development of mobile phone processor technology, more and more four core and even eight core processors have entered the user's vision, and the temperature of these SoCs has risen sharply due to multi-core and high frequency. How does OPPO R5, the thinnest mobile phone in the world, solve this problem? Let's see:

The mobile phone works in a high-temperature environment for a long time, which may cause the mobile phone to crash, restart, reduce stability, or accelerate the aging of mobile phone components. In addition, for current high-frequency CPUs and GPUs, high temperature is likely to cause frequency reduction problems, which will significantly reduce the performance of mobile phones.

Generally, the solution for mobile phones is to stick a layer of graphite sheet at the place where heat conduction is needed to improve the thermal conductivity of the surface of parts. The thermal conductivity of graphite sheet is K>100, and the thermal conductivity is excellent. However, due to the isolation of air, the efficiency of heat transfer from the chip with high calorific value to the graphite sheet is relatively low, so the heat of mobile phones is relatively concentrated and cannot be quickly dissipated.

It can be seen that the heat of ordinary mobile phones is concentrated on the SoC.

OPPO R5 has the world's thinnest 4.85mm body and is equipped with an 8-core 64 bit SoC. How does it solve the problem of internal heat dissipation of mobile phones?

According to the official introduction of OPPO, the core of the ice nest heat dissipation is to use liquid like metal materials as the heat conduction medium (thermal conductivity K=3.3), fill the air between the chip and the graphite chip (thermal conductivity K=0.023), so that the heat can be quickly transferred to the mobile phone skeleton, and evenly spread through the graphite chip on the skeleton.

Comparison of three cooling modes.

The IC of R5 is concentrated on one side of the motherboard.

In addition, since the heat conduction medium is made of liquid like metal, if it directly contacts with SoC and other ICs, the problem of short circuit will occur. R5 also uses a single-sided cloth board to solve this problem, placing SoC and other chips on one side of the motherboard, and pasting a liquid like metal heat conduction sheet on the other side. When the temperature of the mobile phone rises, the liquid like metal becomes liquid, filling the gap between the main board and the middle frame, thus improving the heat dissipation speed.

The disassembly drawing of R5 motherboard shows that the whole motherboard is relatively compact.

R5 disassembly drawing shows that the thickness of the main board, battery and Super AMOLED screen is very low.

The heat of R5 is not as concentrated as that of ordinary mobile phones, and the maximum temperature is well controlled.

Related properties of quasi liquid metal:

Working temperature: start working at 27 ° C, complete phase transition from solid to liquid at 45 ° C

Service life: more than 3 years

Liquidity test: at 70 ° C, 96 hours of test, there will be no flow or overflow problems.