Single side critical cloth board vivo X5Max disassembly drawing appreciation | Ainongji - 上海419贵族宝贝-上海后花园1314-上海品茶网-阿拉爱上海

The vivo X5Max was officially released on December 10. It successfully won the title of the world's thinnest mobile phone with a thickness of 4.75mm. On the basis of this thickness, it still retains a 3.5mm headphone interface. What structure is it implemented through? Let's take a look at the internal structure of X5Max:

The front panel of X5max still has an obvious vivo "family face".

The back is still our familiar three-stage design, and the middle part is made of metal.

We use the 3.5mm at the top as the "notch" to pry off the upper protective cover from the side. The protective cover is fixed with a snap. When prying off, we should not use too much force.

Open it in the same way below, but use the micro USB interface below as a breakthrough.

In addition, take out the SIM card slot first.

There is a small protective cover on the metal back cover, and it is fixed with screws. Remove it first.

Next, remove the metal back cover, which is also fixed on the body by means of snap, which is difficult to remove.

As you can see, the motherboard of X5Max is "L" type

To further disassemble, we first cut off the power supply of the phone and pry off the battery cable.

Next, we remove the card slot. There are three screws on the card slot to fix it. After removal, pry off the flat cable.

There are speakers, microphones and microUSB connectors at the bottom of the fuselage. They use the same ribbon cable as the card slot. You can see the internal structure by removing the plastic cover at the bottom.

The card slot of the X5Max is very special. It adopts the design of dual SIM card+TF card. Card 1 supports micro SIM card (mobile 4G, 3G network), and card 2 supports Nano SIM or TF card (only GSM network is supported, choose one of the two cards).

To take out the motherboard, we also need to pry open the flat cable of the button.

The L-type mainboard was removed successfully, and it can be seen that the cloth board on the mainboard is very compact.

The X5Max adopts a one-sided critical layout design, and the one-sided degree is up to 90%, so there are almost no components on the back of the motherboard.

The X5Max still retains a 3.5mm headphone interface in the 4.75mm body. Vivo uses a design called "cocoon interlocking headphone structure" to further control the thickness of the headphone socket.

Let's take a look at the audio chip that X5Max is proud of, the ES9018K2M digital to analog conversion chip. We are sure that everyone will be familiar with this chip. Vivo has been used in both X3 and Xplay3S, which can be said to be the most powerful digital to analog conversion chip used in mobile phones.

Also from ESS, the Sabre 9601K operational amplifier chip has greatly improved the audio architecture of the X5Max, introducing a secondary operational amplifier. The 9601K chip is a primary operational amplifier of the X5Max, and it is a new chip exclusively used by vivo.

This is Texas Instruments OPA1612, but there is no model identification on the chip. It is estimated that vivo has adopted a new package. OPA1612, as the secondary operational amplifier of X5Max, is also used by Meizu MX4 Pro.

In addition to excellent playback quality, X5Max also continues the characteristics of X5 "king of karaoke", adding Yamaha YSS205X, a digital surround sound signal processing chip, to make X5Max have excellent karaoke performance.

In terms of cameras, the X5Max adopts a 13 megapixel camera at the rear, with an aperture of F2.0, and a 5 megapixel camera at the front, with an aperture of F2.4. The rear camera adopts the second generation stack sensor of Sony IMX214.

Due to the ultra-thin body, the X5Max has to compromise on battery capacity. It uses a 2000mAh lithium battery.

The X5Max disassembles the family photo (because the metal shield on the X5Max is welded on, and considering that we have a limited quantity of 500 evaluation machines, the disassembly is over).