As major manufacturers are constantly pursuing thin and light design, the layout of mobile phone motherboard is a test of manufacturers' R&D strength. The vivo X5Max released in December has its own unique advantages in this respect. It uses a motherboard design called "single-sided critical layout" to make the fuselage design more compact.

The vivo X5Max will challenge the fuselage thickness of less than 5mm, and the key technology to achieve this ultra-thin fuselage is the single-sided critical layout. This technology concentrates 90% of the 786 components on the main board on one side, greatly reducing the thickness of the cloth board and ensuring the extreme thinness of the mobile phone.