For mobile phones with quad core processors, heat dissipation has always been a big problem. OPPO N3 will use a new liquid metal heat dissipation technology, which can effectively solve the problem of mobile phone heat dissipation.

In the traditional heat dissipation design of mobile phones, the CPU chip is covered with a metal shield, and the metal shield is covered with a thermal conductive graphite sheet, but there is air in the middle, and the thermal conductivity of the air is only 0.023 W/m.k. This air layer is not conducive to heat conduction, which largely restricts the heat dissipation efficiency.

In the OPPO ice nest cooling system, liquid like metal replaces air and covers the mobile phone chip. When a certain temperature is reached, the liquid like metal changes from solid to liquid, which fits the chip more closely, has better contact with the heat source, and accelerates heat transfer. (When the temperature reaches about 27 degrees, this layer of liquid metal can transform from solid to liquid); The thermal conductivity of liquid like metal is 3.3W/m.k, more than 140 times that of air, which greatly improves the heat dissipation efficiency.