With the release of iPhone 6 and iPhone 6 Plus, Apple's dark history of not having a large screen is swept away. The attention of iPhone 6 Plus is much higher than that of previous models.
The screen, processor, camera and battery capacity of the iPhone 6 Plus have all been improved to varying degrees. It is estimated that the internal layout of the machine will also be greatly changed. On the big day when the new generation iPhone goes on sale, let's take a preemptive look at the disassembly of the iPhone 6 Plus.
hardware configuration
Apple 64 bit A8 chip, 1G memory (cuvette)
Second generation M8 coprocessor
16/64/128GB capacity
5.5 inch 1920 x 1080 resolution (401 ppi) Retina HD display
8 megapixel iSight camera (1.5 micron pixel length, equipped with Focus Pixels auto focus and optical anti shake ）， Front 1.2 megapixel FaceTime camera
Touch ID fingerprint identification sensor, barometer, three-axis gyroscope, acceleration sensor, and light sensor
Disassembly
▲ The size of iPhone 6 Plus is 158.1 * 77.8 * 7.1 mm. 7.1 mm is thicker than 6.9 mm of iPhone 6, but still thinner than last year's iPhone 5s (7.6 mm
▲ Just like the iPhone 5s, the iPhone 6 Plus has three different colors to choose from: silver, gold, and space gray. The gold version of this disassembly is A1524
▲ The prominent camera on the new iPhone 6 is one of the most complained about places (the other is two big white belts up and down). Although the lens is made of sapphire glass, its outer ring is still metal, which should be paid special attention to in normal use
Similar to the HTC One M8, the iPhone 6 Plus also has two white plastic antennas on the back to prevent the metal body from blocking wifi, Bluetooth and other wireless signals.
▲ Although the iPhone still uses Apple's patented pentagonal screw, it has no hot melt adhesive design, which is very gratifying (no need to use an air blower to disassemble the device)
▲ It's still the classic suction cup method
▲ Similar to the iPhone 5s, the display cable is firmly fixed on the metal frame
▲ The internal layout of the 6Plus is very similar to that of the 5s. In addition to the enlarged body, the volume of the battery has also increased a lot
▲ The home key is fixed by a metal bracket. After unscrewing the screw, the key can be easily taken out
▲ This is the home key module integrated with fingerprint unlocking
▲ The front camera and earpiece are integrated into the same module. If any one breaks, it will be replaced as a whole
▲ The module also includes light and distance sensors
▲ Lift off the metal cover and disconnect the battery cable
▲ Find the battery adhesive strip under the battery, pull it in the right direction to pull out the whole strip, and then the battery can be taken out smoothly
▲ The battery capacity is as rumored, 2915mAh, and the voltage is 3.82V, totaling 11.1w. This is nearly double the capacity of 5s, and also higher than 2880mAh of Samsung S5
▲ This time, the vibrator is placed on the right side of the battery, just below the mainboard
▲ The rear camera can be easily taken out. Its parameters are 8 million pixels (the length of a single pixel is less than 1.5 μ m), and the aperture is ƒ/2.2
▲ The sign on the back of the iSight camera is DNL43270566F MKLAB
▲ The camera has added optical anti shake and "Focus Pixel" auto focusing functions. The "Focus Pixel" technology has been used in SLR for a long time, but it is still rare in mobile phones. However, the Samsung S5 launched previously also uses this technology
▲ When the lens cover is removed, it can be seen that the lens module with optical anti shake is equipped, and there is a magnetic induction coil on the lens frame
▲ There is also a magnetic induction coil on the sensor cover plate. Under the interaction of the lens and the sensor coil, the lens can float freely to offset the jitter during the photographing process
▲ Unscrew several screws and unlock the antenna connector on the back of the motherboard to take out the motherboard
The red box is Apple's A8 APL1011 SoC, and Elpida's 1 GB LPDDR3 memory chip is also integrated on it (unfortunately, this time it is still 1 GB memory).
The orange frame is Qualcomm's MDM9625M LTE Modem chip
The yellow box is Skyworks 77802-23 Low Band LTE PAD chip
The green box is Avago A8020 High Band PAD chip
The blue frame part is Avago A8010 Ultra High Band PA+FBARs chip
The pink frame is a TriQuint TQF6410 3G EDGE amplifier chip
The black box part is InvenSense's MP67B six axis gyroscope and accelerometer chip
▲ The real body of A8 chip
▲ Back of main board
The red box is the H2JTDG8UD1BMS 128 Gb (16 GB) flash memory chip of Hynix
The orange box is Murata's 339S0228 WiFi chip
The yellow box is Apple/Dialog PMIC 338S1251-AZ chip
The green box is BCM5976 touch screen control chip of Broadcom
The blue frame part is M8 coprocessor (NXP LPC18B1UK)
The powder frame part integrates NXP 65V10 NSD425 NFC chip and Secure Element module chip
The black box is Qualcomm's WTR1625L RF transceiver chip
▲ Other chips on the back of the motherboard
The red box is Qualcomm's WFR1620 receive only company chip (Qualcomm officially announced that it needs to be used with WTR1625L chip)
The orange box is Qualcomm's PM8019 power control IC chip
The yellow box is the 343S0694 touch transmitter chip of Texas Instruments
The green box is AMS AS3923 chip
▲ Remove the speaker at the lower right corner of the body
▲ Speaker module
▲ Below the speaker is the motherboard, including the Lightning connector and headphone jack
▲ The motherboard also includes an antenna and several antenna interfaces
▲ Many antennas are placed on the metal frame
▲ After removing the upper antenna, there is an antenna underneath
▲ At last, there are only metal cables attached to the metal frame
▲ Power cable
At the end of the disassembly, I have to sigh that Apple's industrial design and workmanship are still as high as they are
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