According to foreign media reports, from hotel towels to football sweaters, all can be marked with radio frequency identification (RFID) chips. At present, scientists have recently developed a kind of paper that can be implanted with radio frequency identification (RFID) chips, which can be used to manufacture smart banknotes, legal documents and packaging labels in the future.

Although radio frequency identification paper already exists, other fields still rely on thicker chips, resulting in thick paper and uneven surface, making people unable to print. However, the research team of North Dakota State University has recently developed a process called "laser activated advanced packaging", which can produce ultra-thin silicon chips and seamlessly embed them into paper. This process uses a plasma etcher to thin the chip, and then uses a laser beam pulse to embed the chip. Val Marinov, the project leader, said that the cost of this process was lower than that of the current manufacturing technology, materials were rarely used, and equipment cost was lower. Moreover, this manufacturing process is twice as fast as other methods.

"Hey, money, come into your pocket."

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