Huawei will launch eight core chip MWC2013 in the second quarter and release P2 | Iooki - 上海419贵族宝贝-上海后花园1314-上海品茶网-阿拉爱上海

When Yu Chengdong, chairman of Huawei Terminal, was interviewed by Engadget at CES2013, he mentioned that Hisense would launch a new K3V3 chip in the second quarter of 2013. The chip would take the Cortex-A15 architecture as the core, and announced that it would launch Ascend P series new products in MWC 2013, and would also break the 6.45mm record of the thinnest mobile phone Alcatel One Touch Idol Ultra in service.

Yu Chengdong has disclosed some information about K3V3 to the media on January 10, and this visit directly shows that K3V3 will have eight CPUs and use the Cortex-A15 architecture as the core. We all know that the A15 consumes a lot of power, so the eight core CPU of the K3V3 is probably the same as that of Samsung Exynos 5 OCTA The same way, four A15 And 4 A7 Core collocation, in line with ARM's big LITTLE standards.

In the era of K3V2, the GPU equipped with GC4000 has many problems in compatibility and performance, so the selection of GPU for K3V3 will be very promising. In May 2012, Imaging Technologies signed a licensing agreement for PowerVR with HiSilicon, including chips of PowerVR Series 6. If HiSilicon really uses the PowerVR Series 6 series GPU in K3V3, it will solve the problems of performance and compatibility.

In addition to the information about K3V3, Yu Chengdong also said that Huawei would launch a new product of Ascend P series in MWC 2013, which is likely to be Ascend P2, and it will set a new record for the world's thinnest mobile phone. Previously, the world's thinnest mobile phone was the 6.45mm Alcatel One Touch Idol Ultra. The figure below is One Touch Idol Ultra ▼

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