April 27 is the world premiere date of Galaxy S4, and the famous disassembly website The 4+4 core version of Galaxy S4 has been disassembled and some internal chips have been analyzed.

The disassembled is a white Galaxy S4 (Exynos 5410 version)

First, disassemble the shell. It can be seen that the layout of the motherboard is very compact

The motherboard was disassembled, and it can be seen that many of the components above have used modular design, which also greatly reduces the maintenance cost

After the camera, vibration motor and card slot are disassembled, more chips can be seen, including Intel PMB9820/PMB5745 baseband processor, Synaptics S5000B touch controller, etc

The sensor of the camera is Sony IMX135 stack type with 13 million pixels, which is consistent with that on OPPO Find5. Sony stack type cameras are also used in L36h, Xiaomi 2S 32G and other products

Partial picture of IMX135 sensor core

The front camera uses the sensor of Samsung S5K6B2YX03, with 2 million pixels

Partial photo of S5K6B2YX03 sensor core

Of course, the front of the motherboard is the part we most care about. Obviously, the largest chips are Exynos 5410 and memory chips

After disassembling the memory chip, we can see that the SoC model is N5VA101, the chip area is 10.88mm x 11.37mm, and Samsung 28nm LPH process is adopted

SoC metal layer part

Marking of SoC kernel

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